摘要
本文回顾了碳纳米管(CNT)和石墨烯(Gr)增强铜基复合材料的研究进展,探讨了这些复合材料的制备方法、性能提升机制及潜在应用前景。CNT和Gr因独特的物理化学特性,作为铜基复合材料的理想增强相,显著提升了材料的力学性能、导电性和热导率。首先回顾了铜基复合材料的传统制备技术,包括粉末冶金法和机械合金化法,随后介绍了新兴的化学气相沉积(CVD)和电沉积法,这些技术通过直接生长或电化学沉积实现更好的界面结合。对比分析了不同方法的优缺点,指出粉末冶金和机械合金化的成本较低但可能引起增强相分布不均,而CVD法虽能制备高质量材料但成本较高且环境影响敏感。进一步分析了CNT和Gr在铜基体中的分散性及界面结合对性能的影响,强调了良好分散性和强界面结合的重要性。在力学性能方面,CNT和Gr的分散性和界面结合对复合材料的强化机制起着关键作用,包括载荷转移、晶粒细化和Orowan强化等。此外,讨论了CNT和Gr增强铜基复合材料在耐腐蚀性、磨损性能及热管理等方面的应用潜力。尽管存在挑战,但这些复合材料在电力传输、电子器件和航空航天等领域显示出巨大应用前景。未来的研究将集中于微观结构控制、制备工艺创新和多功能复合材料开发,以实现更高性能的工业应用。
This article provided a comprehensive review of the research advancements in carbon nanotube(CNT)and graphene-reinforced copper matrix composites,discussing their fabrication methods,performance enhancement mechanisms,and potential applications.Studies showed that the incorporation of CNTs and graphene significantly improved the mechanical properties,electrical conductivity,and thermal conductivity of copper-based materials,mainly due to their unique physical and chemical properties.CNTs,with their extremely high strength and modulus,and graphene,with its excellent electrical and thermal conductivity,served as ideal reinforcements in copper matrix composites.The article first reviewed the traditional fabrication methods of copper matrix composites,including powder metallurgy and mechanical alloying,and then introduced emerging technologies such as chemical vapor deposition(CVD)and electro-deposition.These new technologies enabled the direct growth or electrochemical deposition of CNTs or graphene on the copper matrix,resulting in better interfacial bonding and enhancement effects.The article also compared the advantages and disadvantages of different fabrication methods,noting that powder metallurgy and mechanical alloying were cost-effective but might result in uneven distribution of the reinforcement phase,while CVD could produce high-quality composites but at a higher cost and with environmental sensitivity.Furthermore,the article analyzed the impact of the dispersion of CNTs and graphene in the copper matrix and the interfacial bonding on the performance of the composites.Good dispersion could maximize the contact area between the reinforcement and the copper matrix,enhancing mechanical properties and electrical conductivity.The strength of the interfacial bonding directly affected the mechanical and electrical properties of the composites,and strategies such as surface modification,microstructural analysis,and the use of bridging molecules could improve interfacial bonding.In terms of mechanical properties,t
作者
姜庆伟
林惠志
丁云航
邵重阳
赵鲸
冯晶
JIANG Qingwei;LIN Huizhi;DING Yunhang;SHAO Chongyang;ZHAO Jing;FENG Jing(Faculty of Materials Science and Engineering,Kunming University of Science and Technology,Kunming 650093,China;Chinalco Luoyang Copper Processing Co.,Ltd.,Luoyang 471039,China)
出处
《铜业工程》
CAS
2024年第5期63-78,共16页
Copper Engineering
基金
国家自然科学基金项目(51201077)资助。
关键词
铜基复合材料
碳纳米管
石墨烯
导电性
力学性能
微观结构
copper matrix composite
carbon nanotube
graphene
electrical conductivity
mechanical property
microstructure
