摘要
离子束抛光作为一种超精密加工技术,被应用于材料表面抛光的精抛阶段,而其原子量级的去除效果使得它的加工过程与加工效果难以直接观察,因此为了能够从微观尺度研究离子束抛光的加工效果以及加工参数对材料表面粗糙度与表面损伤的影响,提出使用分子动力学模拟的方法研究离子束抛光过程,通过对氩离子轰击单晶硅的仿真模拟,分析加工参数对单晶硅表面粗糙度与晶格损伤的影响规律,指导实际的加工工艺设计.研究发现,在不同加工角度下,离子剂量对于表面粗糙度的影响规律不同,低角度(0°~40°)低剂量以及高角度(>50°)高剂量的加工有助于达到较低的表面粗糙度;随着加工角度的增加,离子束对晶体表面造成的损伤逐渐减少,当加工角度大于40°时能够大幅度减少晶格损伤.模拟结果显示在实际的离子束抛光过程中,为了得到高质量的表面,应该采取高角度高剂量的加工方式以达到既降低材料表面粗糙度又减小对材料表面晶格产生损伤的目的.
Ion beam polishing,as a kind of ultra-precision machining technology,is applied to the polishing stage of material surface polishing.The atomic removal effect of ion beam polishing technology makes it difficult to directly observe the processing process and processing effect.In order to study the processing effect of ion beam polishing and the influence of processing parameters on the surface roughness and surface damage of materials from a microscopic scale,the molecular dynamics simulation method was proposed to study the ion beam polishing process.Through the simulation of argon ion bombardment on monocrystalline silicon,the influence of processing parameters on the surface roughness and lattice damage of monocrystalline silicon was analyzed.It is found that the influence of ion dose on surface roughness is different at different machining angles.The processing of low Angle(0°~40°)low dose and high Angle(>50°)high dose helps to achieve low surface roughness.With the increase of the processing Angle,the damage caused by ion beam to the crystal surface gradually decreases,and the lattice damage can be greatly reduced when the processing Angle is greater than 40°.The simulation results show that in the actual ion beam polishing process,in order to obtain high quality surface,high Angle and high dose processing mode should be adopted to reduce the surface roughness and reduce the damage to the surface lattice of the material.
作者
赵仕燕
郭海林
黄思玲
张旭
夏超翔
王大森
聂凤明
裴宁
李晓静
ZHAO Shi-Yan;GUO Hai-Lin;HUANG Si-Ling;ZHANG Xu;XIA Chao-Xiang;WANG Da-Sen;NIE Feng-Ming;PEI Ning;LI Xiao-Jing(Ningbo Branch of China Ordnance Academy,Ningbo 315103,China)
出处
《原子与分子物理学报》
CAS
北大核心
2025年第6期113-121,共9页
Journal of Atomic and Molecular Physics
关键词
离子束抛光
表面质量
分子动力学
单晶硅
加工角度
Ion beam polishing
Surface quality
Molecular dynamics
Single crystal silicon
Machining angle
