摘要
微波电路中包含芯片等大量元器件,这些元器件绝大部分是通过自动贴片的方式实现装配的。针对自动贴片工艺中贴片压力对黏接可靠性的影响进行实验研究,分析了贴片压力对黏接元件四周的溢胶长度、元件底部导电胶的铺展效果及黏接强度的影响。结果表明,在实验参数范围内,贴片压力越大,黏接元件四周导电胶的溢胶长度越长,底部导电胶的铺展效果越好,黏接强度越大。在实际生产过程中,通过增大自动贴片工艺中的贴片压力,可以保证导电胶的黏接可靠性,从而提高电路整体性能。
Microwave circuits contain a large number of components such as chips,and the vast majority of these components are assembled by means of automatic placement.The influence of placement pressure on adhesive reliability in automatic placement process is studied.The influence of placement pressure on the overflow length of the adhesive around the bonding components,the spreading effect of the conductive adhesive at the bottom of the bonding components and the bonding strength is analyzed.The results show that within the range of experimental parameters,the higher the placement pressure,the longer the overflow length of the conductive adhesive around the bonding components,the better the spreading effect of the conductive adhesive at the bottom,and the greater the bonding strength.In the actual production process,the reliability of adhesive bonding can be ensured by increasing the placement pressure in the automatic placement process,so as to improve the overall performance of the circuit.
作者
钟贵朝
蒋苗苗
赵明
韩英
张坤
高胜寒
ZHONG Guichao;JIANG Miaomiao;ZHAO Ming;HAN Ying;ZHANG Kun;GAO Shenghan(China Electronics Technology Group Corporation No.29 Research Institute,Chengdu 610036,China)
出处
《电子与封装》
2024年第10期27-30,共4页
Electronics & Packaging
关键词
组装技术
贴片压力
导电胶溢胶
黏接强度
assembly technology
placement pressure
overflow of conductive adhesive
bonding strength
