摘要
研究了Mo、MoLa、Mo-50W 3种板材的再结晶显微组织及其性能。结果表明:MoLa板再结晶退火温度比Mo板高100℃,Mo-50W板再结晶退火温度比Mo板提高了400℃;Mo-50W板硬度值明显高于MoLa板,MoLa板与Mo板对比硬度值变化不明显;钼及钼合金板的抗拉强度均随着退火温度的升高而不断降低。
Recrystallization microstructure and properties of Mo,MoLa and Mo-50W were studied.The results show that the annealing temperature of MoLa plate is 100℃higher than that of Mo plate,and the annealing temperature of Mo-50W plate is 400℃higher than that of Mo plate;the hardness value of Mo-50W plate is significantly higher than that of MoLa plate,and the contrast change of MoLa plate and Mo plate is not obvious;the tensile strength of molybdenum and molybdenum alloy plate is constantly decreasing with the increase of annealing temperature.
作者
郭雪琪
申坤瑞
郭鑫晴
赵虹淳
GUO Xueqi;SHEN Kunrui;GUO Xinqing;ZHAO Hongchun(ATTL Advanced Materials Co.,Ltd.,Tianjin 301800,China)
出处
《中国钼业》
2024年第5期46-51,共6页
China Molybdenum Industry
关键词
再结晶
金相组织
力学性能
recrystallizing
microstructure
properties
