摘要
采用纯铜/纯铝和纯铜/铝合金进行400℃温轧和退火热处理,并对得到的Cu/Al复层材料进行界面结合强度测试、界面金相显微组织分析和界面扫描电镜分析。结果表明:Cu/Al复层材料界面处Cu/Al中间相的形成需要一定的孕育期,其形成过程为:形核→核长大→沿界面横向连片生长→沿界面法线方向纵向生长;纯铜/纯铝复层材料最佳退火工艺为300℃×1 h,最大界面结合强度可达2.4 N/mm;而纯铜/铝合金为300℃×3 h,界面结合强度最大值为3.1 N/mm,保证了材料的成型性能,同时防止金属间化合物的生成;经较高温度的长时退火(500℃×5 h),纯铜/铝合金比纯铜/纯铝复层材料界面更容易形成脆性金属间化合物相,导致界面结合强度的降低,造成界面在剥离条件下的脆性断裂。
The pure copper/pure aluminum and pure copper/aluminum alloy were used for 400℃warm rolling and annealing heat treatment,and the interface binding strength test,interface metallophase microstructure analysis and interface SEM analysis were also performed for the resulting Cu/Al cladding materials.The results show that,the formation of the Cu/Al mesophase at the Cu/Al cladding materials interface requires a certain gestation period,and the formation process is:nucleation?邛nucleation growth?邛continuous growth along the interface laterally?邛vertical direction along the normal direction of the interface growth.The best annealing process of pure copper/pure aluminum cladding materials is 300℃×1 h,and the maximum interface bonding strength can reach 2.4 N/mm.While the pure copper/aluminum alloy is 300℃×3 h,the maximum interface bonding strength is 3.1 N/mm,which ensures the formability of the materials and prevents the formation of intermetallic compounds.The pure copper/pure aluminum alloy is more likely to form a brittle intermetallic compound phase than the pure copper/pure aluminum cladding material interface,which can lead to the decrease of the interface bonding strength and the brittle fracture of the interface under peeling conditions.
作者
黄国平
汤春江
王群骄
HUANG Guoping;TANG Chunjiang;WANG Qunjiao(Anhui Province Key Laboratory of Microsystem,The 43rd Research Institute of CETC,Hefei 230088,China;School of Materials Science and Engineering,Northeastern University,Shenyang 110819,China)
出处
《热加工工艺》
北大核心
2024年第18期65-68,共4页
Hot Working Technology
基金
武器装备预研基金项目(2006ZYTH0013)。
关键词
Cu/Al复层材料
温轧
退火
界面
中间相
Cu/Al cladding materials
warm rolling
annealing
interface
mesophases
