摘要
为了设计出满足TR组件实际应用的硅基微通道热沉,采用数值模拟方法分别研究了硅基微通道热沉的接地性能、散热性能和耐压性能,并基于仿真结果确定了硅基微通道热沉的关键尺寸和接地方式。研究表明,硅基微通道热沉的外形尺寸为10 mm×10 mm×0.725 mm,散热流道槽宽30 μm,槽深200 μm,导热衬底厚度150 μm时,可满足频段为2~6 GHz、输出功率为44.40 dBm以上的 TR组件应用需求,散热能力达到600 W/cm^(2),并可耐受2.5 MPa的流体压力。
In order to design a silicon-based microchannel heat sink that meets the practical application of T/R module,numerical simulation methods are used to study the grounding performance,heat dissipation performance,and pressure tolerance performance of the heat sink.Based on the simulation results,the key dimensions and grounding method of the heat sink are determined.The results show that T/R module with frequency range of 2~6 GHz and output power of more than 44.40 dBm can work stably when the proper microchannel heat sink is used.The external dimensions of the heat sink are 10 mm×10 mm×0.725 mm,the width and depth of the heat sink channel are 30 μm and 200 μm,and the thickness of the heat sink thermal conductive substrate is 150 μm.This heat sink can meet the heat dissipation needs of 600 W/cm~2,and can withstand pressure of 2.5 MPa.
作者
陈显才
彭文超
林佳
张剑
CHEN Xiancai;PENG Wenchao;LIN Jia;ZHANG Jian(The 29th Research Institute of CETC,Chengdu 610036,China)
出处
《电子工艺技术》
2024年第5期8-12,共5页
Electronics Process Technology
关键词
TR组件
微通道热沉
协同设计
microchannel heat sink
T/R module
collaborative design
