摘要
基于2000—2021年全球通信芯片专利引用数据,构建产业创新网络,从静态和动态两个方面对不同技术发展阶段下的网络韧性进行测度。结果表明:(1)全球通信芯片产业创新网络具有无标度性和异质性特征,2000—2021年,网络韧性呈现“正—正—负”的演化趋势。(2)不同技术发展阶段中,美国企业节点失效始终使得网络综合韧性值居于最低水平;韩国、中国内地和中国台湾三地企业2008年后对网络韧性的影响力愈发凸显。(3)网络对随机扰动表现出更强韧性,对有针对性的蓄意攻击更为敏感。
Based on global communication semiconductor patent citation data from 2000 to 2021,the paper establishes an industry innovation network and evaluates network resilience across various technological development stages from static and dynamic perspectives.It finds that:(1)the innovation network of the global communication semiconductor industry displays scale-free and heterogeneous characteristics,with network resilience evolving in a"positive-positive-negative"pattern from 2000 to 2021.(2)Across diverse technological development stages,U.S.corporate nodes'failure consistently results in the lowest overall network resilience values.The influence of enterprises from South Korean,Chinese Mainland,and Chinese Taiwan on network resilience has markedly intensified since 2008.(3)The network exhibits heightened resilience in response to random disturbances but proves more susceptible to deliberate,targeted attacks.
作者
周霞
于娱
施琴芬
ZHOU Xia;YU Yu;SHI Qin-fen(School of Business,Hohai University,Nanjing 211100;School of Business,Nanjing Audit University,Nanjing 211815;School of Business,Suzhou University of Science and Technology,Suzhou 215009)
出处
《软科学》
北大核心
2024年第8期94-104,共11页
Soft Science
基金
国家自然科学基金项目(72171122)。
关键词
芯片产业
创新网络
静态韧性
动态韧性
专利引用
semiconductor industry
innovation network
static resilience
dynamic resilience
patent citations
