摘要
根据合作专利数据来构建集成电路协同创新网络。在结构重要度基础上,通过检索关键核心专利提取集成电路产业的关键核心技术,最终构建集成电路协同创新网络关键节点评价指标体系,进而提出改进的TOPSIS-灰色关联法来识别集成电路产业关键节点企业。结果发现:我国集成电路产业在下游封测环节拥有较多的关键节点企业,而在上游设计和中游制造环节与发达国家相比还存在较大差距,中芯国际在制造环节排名全球第十位。该结果与现实情况基本吻合,验证了识别方法的有效性。最后,根据识别结果提出了我国集成电路产业高质量发展的对策建议。
Firstly,this paper constructs the IC collaborative innovation network by retrieving collaborative patent data.Based on structural importance,it extracts existing key core technologies by retrieving key core patents,and then establishes a key node evaluation index system.Next,an improved TOPSIS-grey correlation evaluation method is proposed to identify the key node enterprises in the IC collaborative innovation network.Results show many key core node enterprises in the downstream integration and test of China's IC industry with obvious technological advantages.However,almost no key node enterprises in the upstream design and midstream manufacturing link compared with developed countries;Semiconductor Manufacturing International Corporation from China ranks tenth in the manufacturing link.It has been found that the evaluation result is consistent with the actual situation,which verifies the effectiveness of the identification method.Finally,this paper proposes some suggestions for promoting the high-quality development of China's IC industry.
作者
张延禄
张方亮
杨乃定
ZHANG Yan-lu;ZHANG Fang-liang;YANG Nai-ding(School of Management,Northwestern Polytechnical University,Xi'an 710072)
出处
《软科学》
北大核心
2024年第8期85-93,共9页
Soft Science
基金
国家社会科学基金项目(23AZD018)
国家自然科学基金项目(71871182)
教育部人文社会科学研究一般项目(20XJA630003)。
