摘要
针对微波光子系统对片上高速调制器件的使用需求,基于铌酸锂材料的线性电光效应,研究通过开展片上器件的光电联合仿真设计,利用与CMOS工艺相兼容的半导体器件制备方法,将低损耗铌酸锂波导、高效耦合模斑转换器、高频微波信号传输线等片上光电器件集成在绝缘体上的铌酸锂(LNOI)晶圆上,实现调制器芯片的片上集成化;采用微光学耦合工艺实现芯片实现光纤阵列的光信号输入输出;采用引线键合方式实现芯片-薄膜电阻-射频接头的阻抗匹配和电信号低损传输;最后采用平行封焊完成芯片-光纤-管壳的气密性封装,以提高调制器的可靠性和环境适应性。测试得到器件光功率插损<6.5 dB,调制带宽>15 G(@3 dB),动态半波电压<6 V(@10 GHz),满足光电振荡器等相关微波光子器件的应用需求。
Aiming at the microwave photonic system's demand for on-chip high-speed modulation devices,based on the linear electro-optic effect of lithium niobate materials,this research carried out the optoelectronic co-simulation design of on-chip devices and used the semiconductor device preparation method compatible with the CMOS process.On-chip optoelectronic devices such as low-loss lithium niobate waveguide,high-efficiency coupling mode spot converter,and highfrequency microwave signal transmission line are integrated on the lithium niobate(LNOI)wafer on the insulator to realize the on-chip integration of the modulator chip.The coupling process using micro-optics realized the optical signal input and output of the optical fiber array on the chip;the impedance matching of the chip-thin film resistor-RF joint and the low-loss transmission of electrical signals were realized by wire bonding;Hermetic packaging was used to improve the reliability and environmental adaptability of the modulator.The test showed that the optical power insertion loss of the device is<6.5 dB,the modulation bandwidth is>15 G(@3 dB),and the dynamic half-wave voltage is<6 V(@10 GHz),meeting the application requirements of photoelectric oscillators and other related microwave photonic devices.
作者
胡文良
尚成林
潘安
齐志强
王晨晟
HU Wen-liang;SHANG Cheng-lin;PAN An;QI Zhi-qiang;WANG Chen-sheng(Huazhong University of Science and Technology,Wuhan National Laboratory for Optoelectronics,Wuhan 430073 China;Huazhong Institute of Electro-Optics-Wuhan National Laboratory for Optoelectronics,Wuhan 430223 China)
出处
《光学与光电技术》
2024年第3期97-102,共6页
Optics & Optoelectronic Technology
关键词
薄膜铌酸锂
相位调制器
微波光子
片上集成
光电振荡器
LNOI
phase modulator
microwave photonic
on-chip integrated
optoelectronic oscillator
