摘要
针对某微带天线阵面焊接难度大、空洞率高的难题,从焊接夹具设计、焊料量控制和焊接工艺方法等方面对微带板与基板之间的焊接进行了研究,形成了微带天线阵面新制造工艺,并对试验样件进行了焊接生产和焊后检测。检测结果表明,该焊接工艺实现了微带天线阵面大面积、高钎透率、高可靠焊接,为后续类似结构的天线阵面焊接提供了工艺指导。
Aiming at the difficulty of welding a high density microstrip antenna array and the high porosity,it studies the welding between the large-area microstrip board and the substrate from the aspects of welding fixture design,solder quantity control and welding process methods.The manufacturing process of microstrip antenna array with large area,high solder penetration rate and high reliability welding is formed,and the welding production and post-welding inspection of the test samples are carried out.The test results show that this welding process realizes the large area,high penetration rate and high reliability of the microstrip antenna array,which provides a practical process approach for the subsequent antenna arrays with similar structures.
作者
李鑫
Li Xin(The 10th Research Institute of CETC,Sichuan Chengdu,610036,China)
出处
《机械设计与制造工程》
2024年第7期131-134,共4页
Machine Design and Manufacturing Engineering
关键词
大面积焊接
焊接夹具
焊料量控制
真空气相焊
large area welding
welding fixture
solder quantity control
vacuum vapor welding
