摘要
为研究单向C_(f)/SiC复合材料划擦去除机理,采用单颗金刚石磨粒开展准静态划擦试验,分析不同压痕载荷下划擦材料的声发射信号变化,结合SEM形貌分析材料的去除行为和划擦去除机理。试验结果表明:声发射信号强度随着压痕载荷增加而增强,相同参数下SB方向信号值更大,信号波动更剧烈。结合声发射信号与SEM形貌分析,得出材料在不同方向的划擦去除行为,材料以脆性去除为主,SA方向纤维以拉伸断裂和纤维拔出为主,SB方向纤维主要断裂方式为弯曲断裂和剪切断裂。根据SEM形貌分析,阐述去除行为的形成过程,即解释材料划擦去除机理。
To investigate the scratch removal mechanism of unidirectional C_(f)/SiC composite materials,quasi-static scratching tests were carried out using a single diamond abrasive grain to analyze the changes in acoustic emission signals of the scratched materials under different indentation loads.These tests were complemented by SEM images to analyze the removal behavior and scratch removal mechanism of the materials.The test results show that the acoustic emission signal value increases with the increase in indentation load.Under the same parameters,the signal value in the SB direction is larger,and the signal fluctuation is more severe.Combining the acoustic emission signal and SEM morphology analysis,it is concluded that the scratch removal behavior of the material varies in different directions.The material primarily undergoes brittle removal.In the SA direction,fibers mainly experience tensile fracture and fiber pull-out,whereas in the SB direction,the main fracture modes of the fiber are bending fracture and shear fracture.According to the SEM morphology analysis,the formation process of the removal behavior and the material scratch removal mechanism are described.
作者
温家宙
王庆霞
余爱武
吴重军
WEN Jiazhou;WANG Qingxia;YU Aiwu;WU Chongjun(Donghua University,College of Mechanical Engineering,Shanghai 201600,China;Shanghai Aerospace Equipments Manufacturer Co.,Ltd.,Shanghai 201108,China;Shanghai Aerospace Process and Equipment Engineering Technology Research Center,Shanghai 201108,China)
出处
《金刚石与磨料磨具工程》
CAS
北大核心
2024年第3期327-334,共8页
Diamond & Abrasives Engineering
基金
国家自然科学基金(52005098)
上海市自然科学基金(22ZR1402400)
上海航天科技创新基金(SAST2022-059)
中国博士后基金(2022M721910)。
