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一种三维集成的Ku波段高功率T/R模块

A 3D Integrated Ku-Band High Power T/R Module
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摘要 基于硅基微电子机械系统(MEMS)三维(3D)异构集成工艺,设计并制作了用于相控阵天线系统的三维堆叠式Ku波段四通道高功率收发(T/R)模块。该模块由两层硅基封装堆叠而成,层间采用球栅阵列(BGA)植球堆叠,实现模块小型化;采用高低阻抗匹配建模,保证低损耗输出,采用导热垫加微流道散热板达到了良好的散热效果,实现模块高功率输出;对模块的微波垂直互连结构和散热进行建模和仿真。测试结果表明,在14~18 GHz内发射通道饱和输出功率大于40 dBm,接收通道增益大于21 dB,噪声系数小于3.5 dB,模块尺寸仅为14.0 mm×14.0 mm×3.3 mm。该模块在兼顾高集成度的同时性能指标得到了进一步提升。 Based on three-dimensional(3D) heterogeneous integration technology of the silicon-based micro-electromechanical system(MEMS),a Ku-band four-channel high-power 3D stacked transceiver(T/R) module for phased array antenna system was designed and fabricated.The module consisted of two layers of silicon-based packages stacked with solder balls by ball grid array(BGA) between layers to achieve miniaturization.High and low impedance modeling was adopted to ensure low loss output, and thermal pad and heat dissipation plate with microchannel were adopted to reach good heat dissipation effect and achieve high power output of the module.The microwave vertical interconnection structure and heat dissipation of the module were modeled and simulated.The test results show that in 14-18 GHz, the saturation output power of the transmitting channel is greater than 40 dBm, the gain of the receiving channel is greater than 21 dB,the noise figure is less than 3.5 dB,and the module size is only 14.0 mm×14.0 mm×3.3 mm.While taking into account high integration, the performance indicators of the module were further improved.
作者 陈兴 张超 陈东博 赵永志 Chen Xing;Zhang Chao;Chen Dongbo;Zhao Yongzhi(The 13^(th)Research Institute,CETC,Shijiazhuang 050051,China)
出处 《半导体技术》 CAS 北大核心 2024年第6期569-574,共6页 Semiconductor Technology
关键词 硅基微电子机械系统(MEMS) 收发(T/R)模块 三维集成 高功率 散热设计 silicon-based micro-electromechanical system(MEMS) transceiver(T/R)module 3D integration high power heat dissipation design
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