摘要
简述了陶瓷薄膜电路生产工艺的主要流程。制备薄膜的关键工艺会影响陶瓷与金属复合膜层之间的结合力,结果体现在使用终端的严重致命失效。例如研磨抛光工艺稳定性会影响陶瓷表面状态从而导致陶瓷与金属粗糙度的差异过大;磁控溅射线列式溅射过程中的真空度和溅射功率会影响膜层的致密性;湿法刻蚀与干法刻蚀的相关工艺参数影响微带线的平整性等。介绍了以上工艺的现状以及未来的发展趋势。
The main production process of ceramic film circuit was briefly described.The key process of film preparation will affect the bonding force between ceramic and metal composite films,as a result it was a serious fatal failure mode at the end of use.For example,the stability of the grinding and polishing process will affect the surface state of ceramics,which will lead to excessive differences in the roughness between ceramics and metals,the vacuum degree and sputtering power in the process of magnetron sputtering line will affect the film density,the process parameters of wet etching and dry etching affected the flatness of microstrip lines.The current situation and development trend of the above processes in the future were also introduced.
作者
赖辉信
LAI Hui-xin(Aurora Technologies Co.,Ltd.,Guangdong Guangzhou 511458,China)
出处
《广州化工》
CAS
2023年第24期7-9,共3页
GuangZhou Chemical Industry
关键词
薄膜电路
研磨抛光
磁控溅射
图形刻蚀
thin film circuit
grinding and polishing
magnetron sputtering
pattern etching
