摘要
综述了丙烯酸酯基导电压敏胶的三类填料的研究进展,包括金属填料、无机非金属填料以及杂化填料。对丙烯酸酯基导电压敏胶的结构设计进行了汇总,包括在丙烯酸酯基础上接入氨基甲酸酯键、环氧基团的导电压敏胶。最后对丙烯酸酯基导电压敏胶未来发展进行了展望。
The research progress of three types of fillers for acrylate-based conductive pressure sensitive adhesive,including metal fillers,inorganic non-metallic fillers,and hybrid fillers were reviewed.The structural design of acrylate-based conductive pressure sensitive adhesive,which includes accessing to urethane bond and epoxy group on the basis of acrylate-based conductive pressure sensitive adhesive was summarized.Finally,the future development of acrylate-based conductive pressure sensitive adhesive was prospected.
作者
徐丹
张军营
牛栋华
宋佳赟
刘彤
程珏
Xu Dan;Zhang Junying;Niu Donghua;Song Jiayun;Liu Tong;Cheng Jue(Beijing Tianyu Aerospace New Material Technology Co.,Ltd.,Beijing 101407,China;College of Materials Science and Engineering,Beijing University of Chemical Technology,Beijing 100020,China)
出处
《中国胶粘剂》
CAS
2024年第4期10-18,共9页
China Adhesives
关键词
导电压敏胶
丙烯酸酯
导电填料
conductive pressure sensitive adhesive
acrylate
conductive filler
