摘要
为了解决数据中心服务器面临的高热流密度及高能耗问题,对比了横向平行长流道、竖直平行长流道、横竖均通十字3种流道结构对芯片的冷却效果,确定最佳流道结构和肋片间距,并对机柜芯片组进行数值模拟,得到了维持芯片组安全工作(70℃)所需最小流量随入口水温的变化曲线。研究结果表明:横向平行长流道的综合散热性能最好,综合性能换热因子提升41.4%;采用横向平行长流道结构,肋片间距为0.3 mm时,芯片散热效果最好;维持芯片组安全工作时,入口温度低于10℃时,对流量的需求很小,仅为62.5 g/s,入口温度高于30℃时,流量需求迅速增加,增长幅度高达44.2%,并给出了入口温度和最小流量之间的拟合公式。
In order to solve the high heat flux density and energy consumption problems faced by data center servers,a comparison was conducted among three channel structures for chip cool-ing,including horizontal parallel long channels,vertical parallel long channels and a cross-channel configuration with both horizontal and vertical access.The study aimed to identify the optimal channel structure and fin pitch,numerical simulations were performed on server rack chip assem-blies to determine the minimum flow rate required to maintain the safe operation of chip assemblies(70℃)as a function of the inlet water temperature.The results indicates that the horizontal par-allel long channel structure offers the best overall cooling performance,enhancing the comprehen-sive heat transfer factor by 41.4%.With a fin pitch of 0.3 mm in the horizontal parallel long channel structure,the chip cooling is most effective.To maintain safe operation of the chip assem-bly,when the inlet temperature is below 10℃,the demand for flow rate is minimal,only 62.5 g/s.However,as the inlet temperature exceeded 30℃,the demand for flow rate increases signifi-cantly,with a growth rate of up to 44.2%.The study also provides a fitted formula between inlet temperature and minimum flow rate.
作者
张迪
陈华
覃海燕
Zhang Di;Chen Hua;Qin Haiyan(Tianjin Key Laboratory Refrigeration Technology,Tianjin 300134,China;College of Mechanical Engineering,Tianjin University of Commerce,Tianjin 300134,China)
出处
《低温工程》
CAS
CSCD
北大核心
2024年第2期61-67,98,共8页
Cryogenics
基金
天津市自然科学基金项目(No.18 JCYBJC90300)资助。
关键词
数据中心
水冷散热器
数值模拟
流道结构优化
data center
water-cooled heat sink
numerical simulation
channel structure optimization
