摘要
手工焊接后的多层瓷介电容器在温度循环试验过程中发生烧毁故障,故障原因为焊接过程中热应力较大导致器件本体生成裂纹。设计手工焊接试验,并经验证得出结论:在手工焊接过程中,通过降低手工焊接温度,增加焊接前印制电路板(PCB)的预热,可以避免器件本体产生裂纹;在产品设计阶段,避免选用较大尺寸封装,为PCB设计非接地焊盘,可以提高手工焊接的工艺窗口,从而提升多层瓷介电容器手工焊接质量。
The multi-layer ceramic dielectric capacitor after manual welding was burned out in the process of temperature cycle test,and the malfunction was located in the welding process with large thermal stress causing device body cracks.It is concluded through the design and implementation of manual welding test and verification.That in the process of manual welding,the cracks in the device body can be avoided by reducing the temperature of manual welding and increasing the preheating of the printed board before welding.And in the product design stage,avoiding the selection of large size package and designing non-grounding pad for the printed board,can improve the process window of manual welding.Thus,the quality of manual welding of multi-layer ceramic dielectric vessel can be improved.
作者
牛润鹏
李龙
毛飘
郑龙飞
李娟
党琳娜
NIU Runpeng;LI Long;MAO Piao;ZHENG Longfei;LI Juan;DANG Linna(Xi’an Aeronautics Computing Technique Research Institute,AVIC,Xi’an 710000,Shaanxi,China)
出处
《印制电路信息》
2024年第4期53-56,共4页
Printed Circuit Information
关键词
多层瓷介电容器
手工焊接
热应力
裂纹
multi-layer ceramic dielectric capacitor
manual welding
thermal stress
crack
