摘要
随着电子器件向高频高压、大功率方向发展,对半导体器材的性能提出了更高的要求。单晶金刚石具有高热导、耐高温、超宽禁带、击穿电压高等特性,被视为终极半导体材料。若要充分发挥金刚石的性能,其表面需要具有超光滑和近乎无损伤的表面。然而,金刚石不仅硬度大、化学性质稳定、难去除,而且脆性大、断裂性韧性低、极易产生加工损伤,这严重制约了金刚石在半导体领域的应用。有关金刚石高效超低损伤的加工机理和工艺,国内外学者展开了大量研究。但到目前为止,并没有一套适合于金刚石高效超低损伤的加工理论和工艺。在介绍了金刚石现有加工方法及其优缺点的基础上,概述了金刚石加工工艺的研究现状,并从实验表征和模拟计算两方面系统地总结了有关金刚石高效超低损伤加工机理以及相关的工艺研究进展,最后分析了目前实现金刚石高效超低损伤加工面临的问题、难点及未来发展趋势,为今后金刚石半导体器件的制造技术及理论提供借鉴。分析表明,机理方面,实验表征与模拟计算相结合是获得更多的动态原子细节信息的有效方式,是未来在原子尺度阐明加工机理的发展方向。工艺方面,化学机械抛光方法可以用于平坦化大尺寸材料加工,同时也可以获得具有超光滑超低损伤表面的金刚石,但去除率低是限制该方法应用的瓶颈问题,通过金刚石磨粒+强氧化剂+外部能场辅助的加工方法是实现金刚石高效超低损伤加工的发展方向。
With the development of electronic devices towards high frequency,high voltage and high power,the higher requirements are put forward for the performance of semiconductor materials.Single crystal diamond has the characteristics of high thermal conductivity,high temperature resistance,ultra-wide band gap and high breakdown voltage,which is regarded as the ultimate semiconductor material.To give full play to the properties of diamond,the diamond need possess the surface morphology of super smooth and almost non-damaging.Nevertheless,diamond not only has the highest hardness,stable chemical properties and is difficult to remove,but also has great brittleness,low fracture toughness and easy to produce processing damage,which seriously restricts the development of diamond in the field of semiconductor.The processing mechanism and technology of diamond with high-efficiency and ultra-low damage have been studied by scholars at home and abroad.But up to now,there is no set of processing theory and technology suitable for diamond.On the basis of summarizing the processing methods with their advantages and disadvantages regarding diamond,the research status of diamond processing are summarized,the research progress on the mechanism of high-efficiency and ultra-low damage of diamond and related processes are summarized systematically from the aspects of experimental instrument detection and simulations and finally the current problems and future development trends of diamond regarding the high-efficiency and ultra-low damage processing are analyzed,which will provide guidance for the manufacturing technology and theory of diamond in the future.The analysis shows that,in terms of mechanism,the combination of experimental detection and simulation is an effective way to obtain more details of dynamic atoms,which is the development direction of elucidating processing mechanism at atomic scale in the future.As for processing technology,chemical mechanical polishing method can be used for the large size flat material processing,a
作者
袁菘
郭晓光
金洙吉
康仁科
郭东明
YUAN Song;GUO Xiaoguang;JIN Zhuji;KANG Renke;GUO Dongming(State Key Laboratory of High-preformance Precision Manufacturing,Dalian University of Technology,Dalian 116024)
出处
《机械工程学报》
EI
CAS
CSCD
北大核心
2024年第3期337-353,共17页
Journal of Mechanical Engineering
基金
国家自然科学基金(5217052183)
华中科技大学重点实验室开放基金(DMETKF2020013)资助项目。
关键词
金刚石
高效超低损伤
半导体材料
工艺与机理
diamond
high-efficiency and ultra-low damage
semiconductor materials
processing and mechanism
