摘要
在扫描电子显微镜(SEM)下观察覆铜板(CCL)及印制电路板(PCB)的切片,发现玻纤与树脂间存在微裂纹现象。在传统的认知中,对这种现象的解释是由于玻纤与树脂间浸润不良而导致微裂纹的产生,即黏结间隙问题。在SEM下观察切片,发现扫描对焦过程中原本结合良好的玻纤与树脂位置出现裂缝和变形现象。为了深入了解这一现象,设计了试验方案进行验证。通过试验,对玻纤与树脂界面黏结间隙现象进行模拟,筛选出其影响因素,给业界提供一些参考。
The bonding gap is a possible failure between glass fiber and resin in the copper clad laminate(CCL).Microcracks between glass fiber and resin are found by observing the cross sections of copper clad laminate and printed circuit board(PCB)under scanning electron microscope.The traditional explanation for this phenomenon is that microcracks occur due to poor infiltration between the glass fiber and the resin,which should be well combined.In order to make deeper understanding on this problem,we design an experimental scheme for verification.This paper mainly simulates the phenomenon of bonding gap between glass fiber and resin through experiments,screens out its influencing factors,and gives some references to industry peers.
作者
王必琳
王立峰
李超
陈锡强
WANG Bilin;WANG Lifeng;LI Chao;CHEN Xiqiang(Shengyi Technology Co.,Ltd.,Dongguan 523039,Guangdong,China)
出处
《印制电路信息》
2024年第3期4-8,共5页
Printed Circuit Information
