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AlO(OH)/聚酰亚胺复合薄膜的制备及其耐高温性能研究 被引量:2

Preparation and high temperature resistance of AlO(OH)/polyimide composite films
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摘要 以4,4′-二氨基二苯醚为二胺单体,均苯四甲酸二酐为酸酐单体,3-氨基丙基三乙氧基硅烷(KH550)为偶联剂,异丙醇铝[Al(OPri)3]为铝源,采用溶胶-凝胶法制备以聚酰亚胺(PI)为基体,AlO(OH)为增强相的PI复合薄膜。利用扫描电子显微镜(SEM)、傅里叶变换红外光谱、X射线衍射、热重分析仪、差示扫描量热仪、水接触角仪、漆膜划格器、铅笔划痕实验仪等对复合薄膜的结构和性能进行表征。结果表明,随着铝溶胶含量的增加,复合薄膜的热稳定性呈现先上升后降低的趋势。当铝溶胶含量为10%时,AlO(OH)/PI复合薄膜具有最好的耐高温性能,其热分解5%时的温度达到567℃,玻璃化转变温度为381.4℃。 Polyimide(PI)composite films were prepared by the sol-gel method using 4,4′-diaminodiphenyl ether(ODA)as the diamine monomer,phthalic anhydride(PMDA)as the anhydride monomer,3-aminopropyltriethoxysilane(KH550)as the coupling agent,and isopropanol aluminum[Al(OPri)3]as the aluminum source.PI was used as the matrix,and AlO(OH)served as the reinforcement phase.The structure and properties of the composite films were characterized by SEM,FTIR,XRD,TG,DSC,water contact angle measurement,paint film marker,and pencil scratch tester.The results show that the thermal stability of the composite films first increases and then decreases with the increase of the content of aluminum sol.When the content of aluminum sol is 10%,the AlO(OH)/PI composite films exhibits the best high-temperature resistance,with the 5%weight loss temperature reaching 567℃and the glass transition temperature of 381.4℃.
作者 郑立环 张松 王力 高彦峰 ZHENG Li-huan;ZHANG Song;WANG Li;GAO Yan-feng(School of Materials Science and Engineering,Shanghai University,Shanghai 200444,China)
出处 《应用化工》 CAS CSCD 北大核心 2024年第2期268-272,共5页 Applied Chemical Industry
基金 国家自然科学基金(51873102) 上海市教育委员会科研创新项目(2019-01-07-00-09-E00020)。
关键词 聚酰亚胺 耐高温 热稳定性 复合薄膜 polyimide high temperature resistance thermal stability composite films
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