摘要
为研究不同温度应力对Au-Al键合的可靠性影响,对陶封器件采用温度循环试验、高温贮存试验,分析陶封器件Au-Al键合点的金属间化合物(IMC)微观组织结构。结果显示,两种温度应力条件下都出现明显分层现象,且由于固固扩散反应,分层界面处应力集中,裂纹更易萌生扩展,降低可靠性;对比3000次温循、150℃/360h、250℃/360h试验条件下分层界面处的裂纹形貌,裂纹长度逐渐增加,说明恒定温度应力更易促进IMC裂纹生长,且温度越高,裂纹生长越快,对器件可靠性影响也越大。
In order to study the influence of different temperature stress on the reliability of Au-Al bonding,the temperature cycles test and high temperature storage test are used to analyze the intermetallic compound(IMC)microstructure of the Au-Al bonding point of the ceramic packaged device.The results show that obvious delamination phenomenon occurs under both tempera⁃ture stress conditions.Due to solid-solid diffusion reaction,stress is concentrated at the delamination interface,crack is more likely to initiate and expand,which cause the reliability of device reduced.Comparing the crack morphology at the delamination interface under the test conditions of 3000 temperature cycles,150/360h,and 250/360h,the crack length gradually increases,indicating that constant temperature stress is more likely to promote IMC crack growth.When the temperature is higher,the crack growth is faster,which result in greater impact on device reliability.
作者
李振远
万永康
虞勇坚
孟智超
LI Zhenyuan;WAN Yongkang;YU Yongjian;MENG Zhichao(No.58 Research Institute,China Electronics Technology Group Corporation,Wuxi 214035)
出处
《舰船电子工程》
2023年第12期223-227,共5页
Ship Electronic Engineering
基金
科技部国家重点研发计划“高温传感器专用ASIC工艺平台开发”(编号:2021YFB3202703)资助。
关键词
陶瓷封装
Au-Al键合
温度应力
金属间化合物
可靠性
ceramic packaging
Au-Al bonding
temperature stresses
intermetallic compound
reliability
