摘要
经调查发现对电路板进行灌封可有效的提高电路板的可靠性。电路板灌封是指将聚氨酯灌封胶、有机硅灌封胶、环氧树脂灌封胶等一种或多种灌封材料用设备或手工方式灌入电路板,在常温或加热条件下固化成为性能优异的热固性高分子绝缘材料,从而达到防潮保护、防水保护、抗冲击保护、抗振动保护、耐腐蚀保护、绝缘保护的目的。
After investigation,it was found that encapsulating circuit boards can effectively improve their reliability.Circuit board potting refers to the process of injecting one or more potting materials such as polyurethane potting adhesive,organic silicon potting adhesive,epoxy resin potting adhesive,etc.into the circuit board using equipment or manual methods,and curing them at room temperature or heating conditions to form thermosetting polymer insulation materials with excellent performance,thereby achieving the goals of moisture-proof protection,waterproof protection,impact protection,vibration resistance protection,corrosion resistance protection,and insulation protection.
作者
孙浩棋
史红利
董蕾
柴昨如
何锦金
SUN Hao-qi;SHI Hong-li;DONG Lei;CHAI Zuo-ru;HE Jin-jin(Zhengzhou Jinyang Electric Co.,Ltd.,Zhengzhou,Henan 450000,China)
出处
《移动电源与车辆》
2023年第4期46-49,共4页
Movable Power Station & Vehicle
关键词
电路板
灌封
有机硅灌封胶
circuit board
Potting
Silicone potting adhesive
