摘要
针对酸性硅溶胶(SiO_(2))抛光液稳定性较差的问题,研究在磨料质量分数为16%,抛光液pH值为3的条件下,添加不同浓度阴离子表面活性剂烷基多苷磺基琥珀酸单酯盐(APG)、非离子表面活性剂脂肪醇聚氧乙烯醚-9(AEO-9)、高聚物聚丙烯酸(PAA)、聚乙二醇(PEG)对酸性抛光液的分散性能与SiO_(2)去除速率的影响。通过研究不同分散剂对抛光液的Zeta电位、粘度、紫外光谱、去除速率的影响,确定了不同分散剂的最佳浓度。研究表明,当在抛光液中分别滴加质量分数0.15%AEO-9、0.1%PEG、0.2%PAA、0.15%APG时,其抛光液的分散性能与抛光性能达到最佳;其中AEO-9的分散效果与抛光性能最好,在溶液中滴加质量分数0.15%AEO-9时,其溶液Zeta电位为-31.04 mV,粘度为5.58 mPa·s,去除速率为311.2 nm/min,并可使表面粗糙度降至0.235 nm。揭示了AEO-9在酸性硅溶胶体系下的作用机理。
To address the poor stability of the acidic silica slurry,the doping effects of anionic surfactant alkyl polyglucoside sulfate succinate salt(APG),nonionic surfactant alkyl alcohol polyoxyethylene ether-9(AEO-9),polymers polyacrylic acid(PAA)and polyethylene glycol(PEG)on the dispersion performance and removal rate of the acidic polishing solution were studied.The optimal concentration of different dispersants was determined by measuring the Zeta potential,viscosity,UV spectrum,and removal rate of the polishing solution.It is found that the optimal dispersion performance and polishing performance can be achieved when adding 0.15%AEO-9,0.1%PEG,0.2%PAA,or 0.15%APG to the polishing solution.Among them,AEO-9 shows the best dispersion and polishing performance.When 0.15%AEO-9 is added to the solution,the Zeta potential is-31.04 mV,the viscosity is 5.58 mPa·s,the removal rate is 311.2 nm/min,and the surface roughness can be reduced to 0.235 nm.The mechanism of AEO-9 in the acidic silica sol system was revealed.
作者
陈志博
王辰伟
王雪洁
王海英
盛媛慧
CHEN Zhibo;WANG Chenwei;WANG Xuejie;WANG Haiying;SHENG Yuanhui(School of Electronic and Information Engineering,Hebei University of Technology,Tianjin300130,China;Tianjin Key Laboratory of Electronic Materials and Devices,Tianjin300130,China;Semiconductor Technology Innovation Center(Beijing)Corporation,Beijing102600,China)
出处
《电子元件与材料》
CAS
北大核心
2023年第12期1476-1482,共7页
Electronic Components And Materials
基金
国家自然科学基金(62074049)。
关键词
层间介质
化学机械抛光
分散剂
去除速率
inter layer dielectric
chemical mechanical polishing
dispersants
removal rate
