摘要
有机/无机薄膜封装技术被广泛用于有机发光二极管(OLED)、量子点显示及有机光伏等领域,是一种新型的柔性封装技术。综述近年来有机/无机薄膜封装技术的发展趋势,首先概述了传统硬质盖板封装方式与薄膜封装方式的发展及其优缺点。其次,系统地总结了有机/无机薄膜的制备方法,如原子层沉积、等离子体化学气相沉积等,详细阐述了不同制备方法的原理及其应用。再次,讨论了薄膜的微观缺陷、内应力,以及材料界面工程对有机/无机薄膜封装性能的影响,分析总结了有机/无机封装薄膜制备的技术要点,如采用基底表面预处理、引入中性层、调节层间应力等方式获得优质的封装薄膜。最后,探究了有机/无机封装薄膜的内在阻隔机理,提出气体在有机/无机薄膜中的传输方式以努森扩散为主,并总结了提高薄膜封装的策略,即延长气体扩散路径、“主动”引入阻隔基团及薄膜表面改性。提出了未来薄膜封装技术面临的问题,拟为柔性电子器件封装技术的发展提供一定参考。
Organic/inorganic film packaging technology is widely used in the fields of OLED,quantum dot display and organic photovoltaic.It is a new type of flexible packaging technology.The work aims to summarize the development trend of organic/inorganic film packaging technology in recent years.First of all,the development of traditional hard cover packaging methods and thin film packaging methods and its advantages and disadvantages were outlined.Secondly,the preparation methods of organic/inorganic thin films were systematically summarized,such as atomic layer deposition,plasma chemical vapor deposition,etc.Then,the principles and applications of different preparation methods were elaborated in detail.Once again,the effects of micro defects,internal stress,and material interface engineering on the packaging performance of organic/inorganic thin films were discussed.By analyzing and summarizing the technical points of preparing organic/inorganic packaging thin films,such as substrate surface pretreatment,introduction of neutral layers,and adjustment of interlayer stress,the high-quality packaging thin films were obtained.Finally,the intrinsic barrier mechanism of organic/inorganic packaging films was explored,and it was proposed that gas transport in organic/inorganic films was mainly through Nussen diffusion.Strategies to improve film packaging were summarized,including extending the gas diffusion path,actively introducing barrier groups,and modifying the film surface.This review presents the key challenges faced by future thin film packaging technology,which can provide certain reference value for the development of flexible electronic device packaging technology.
作者
冯尔鹏
董茂进
韩仙虎
蔡宇宏
冯煜东
王毅
马敏
王冠
秦丽丽
马凤英
FENG Erpeng;DONG Maojin;HAN Xianhu;CAI Yuhong;FENG Yudong;WANG Yi;MA Min;WANG Guan;QIN Lili;MA Fengying(Lanzhou Institute of Physics,Lanzhou 730010,China)
出处
《表面技术》
EI
CAS
CSCD
北大核心
2024年第3期101-112,共12页
Surface Technology
基金
中国航天科技集团自主研发项目(JSKF202112140007)。
关键词
柔性电子
有机/无机薄膜封装
界面
内应力
阻隔机制
flexible electronics
organic/inorganic thin film packaging
interface
internal stress
barrier mechanism
