摘要
芯粒(Chiplet)技术可以提升集成芯片良率、降低研发成本并提升效率,因此成为目前的研究热点。不同芯粒之间需要高速数据接口进行互连通信。为提升总带宽密度,芯粒互连多采用单端信号传输数据,因此会受共模噪声、同步开关噪声以及串扰噪声的影响。弦和信令通过对传输数据编解码将单端信号转换为伪差分信号,可以抑制噪声,提高信号传输质量。同时,弦和信令作为一种调制方式,与工艺、架构等无关,工艺移植性良好,因此得到广泛应用。本文对常见的弦和信令进行了回顾,并分析总结了其性能参数,最后对弦和信令的发展进行了展望。
Chiplet technology has garnered significant attention owing to its potential to enhance integrated chip yield,reduce research costs,and bolster efficiency.To facilitate the interconnection of distinct chips,high-speed data interfaces are imperative.With the aim of augmenting total bandwidth density,chiplet interconnections predominantly employ single-ended signals for data transmission,which are susceptible to common-mode noise,synchronous switching noise,and crosstalk noise.Chord signaling transforms single-ended signals into pseudo-differential signals through encoding and decoding transmitted data,enabling noise suppression and enhancement of signal transmission quality.Furthermore,as a modulation technique,chord signaling is extensively adopted due to its process independence,architectural flexibility,and strong process portability.This paper conducts a comprehensive review of prevalent chord signaling techniques,including analysis and summary of their performance.Finally,it offers a perspective on the chord signaling development.
作者
韩晨曦
赵潇腾
刘源
张圻
刘术彬
朱樟明
HAN Chenxi;ZHAO Xiaoteng;LIU Yuan;ZHANG Qi;LIU Shubin;ZHU Zhangming(Xidian University,Xi'an 710071,China)
出处
《集成电路与嵌入式系统》
2024年第2期23-30,共8页
INTEGRATED CIRCUITS AND EMBEDDED SYSTEMS
基金
高能效多电平宽范围高速数据接口接收机关键技术研究(62374126)
高效模拟前端集成电路和集成系统(62021004)
超高速模数转换器集成电路测试验证系统(62227816)
高速射频模数转换器芯片研究(2022YFB4401900)。
关键词
芯粒
共模噪声
同步开关噪声
串扰噪声
弦和信令
Chiplet
common-mode noise
simultaneous switching noise
crosstalk noise
chord signaling
