摘要
通过控制硼含量制备不同界面结构的金刚石/铜复合材料,研究复合材料的界面显微组织及其对热性能和力学性能的影响。结果表明,界面处形成微米级B4C齿状结构,该结构为界面结合提供冶金结合和机械啮合的双重作用。金刚石/铜-硼复合材料获得最高为695 W/(m·K)的热导率和535 MPa的弯曲强度。金刚石与B4C之间形成具有金刚石(111)//B4C (104)取向关系的半共格界面。微纳米级齿状结构可提高界面声子传输效率和界面结合强度。
Different interfacial structures of diamond/Cu composites were synthesized by varying the boron(B)content.The microstructural,thermal,and mechanical properties of the composites were investigated.The results showed that diamond/Cu-B composites had a high thermal conductivity of 695 W/(m·K)and high bending strength of 535 MPa attributed to the formation of a micron-scale dentate B4C interface structure.The dentate B4C provided dual functions of metallurgical bonding and mechanical meshing for interface bonding.A semi-coherent interface was formed between the diamond and B4C,where the diamond(111)and B4C(104)planes were parallel.The micro/nano-scale dentate structure improved the phonon transmission efficiency and bonding strength at the interface.
作者
谢忠南
郭宏
肖伟
张习敏
黄树晖
孙明美
解浩峰
Zhong-nan XIE;Hong GUO;Wei XIAO;Xi-min ZHANG;Shu-hui HUANG;Ming-mei SUN;Hao-feng XIE(State Key Laboratory of Nonferrous Metals and Processes,GRINM Group Co.,Ltd.,Beijing 100088,China;GRIMAT Engineering Institute Co.,Ltd.,Beijing 101407,China;General Research Institute for Nonferrous Metals,Beijing 100088,China)
基金
financially supported by the National Key Research and Development Program of China (No. 2017YFB0406202)。
关键词
金属基复合材料
金刚石/铜复合材料
热导率
界面结构
metal matrix composites(MMCs)
diamond/Cu composites
thermal conductivity
interfacial structures
