摘要
绝缘性能是散热型金属基覆铜板材料的一个非常关键的特性。随着电子产品工作电压的不断提高,对材料绝缘性能的要求也越来越高,而湿、热和持续电压等应用环境都会对材料的绝缘性能产生一定程度的负面影响。从绝缘层厚度、回流焊接、热氧老化、高温高湿加偏压等方面对金属基覆铜板材料绝缘性能的影响进行研究和测试,为材料选型和应用提供必要的参考依据。
Insulation performance is a crucial characteristic of heat dissipation metal based copper clad laminate materials.With the continuous improvement of electronic product working voltage,the requirements for material insulation performance are also increasing.Application environments,such as humidity,heat and continuous voltage,have a certain degree of negative impact on the insulation performance of the material.The effects of insulation layer thickness,reflow soldering,hot oxygen aging,high temperature and high humidity bias on the insulation properties of metal-based copper clad sheet materials are studied and tested,so as to provide necessary reference for material selection and application.
作者
陈毅龙
罗奇
丘威平
刘旭亮
黄奕钊
CHEN Yiong;LUO Qi;QIU Weiping;LIU Xuiang;HUANG Yizhao(Heyuan Key Laboratory of High Density and High Heat Dissipation Circuit Board,Kinwong Electronic Technology(Longchuan)Co.,Ltd.,Heyuan 517373,China)
出处
《电子工艺技术》
2024年第1期43-45,60,共4页
Electronics Process Technology
关键词
散热型金属基覆铜板
绝缘性能
材料选型
测试
heat dissipation metal based copper clad plate
insulation performance
material selection
test
