摘要
从挠性印制电路板(FPCB)的材料、结构、外形设计、线路设计、弯折区域、弯折条件及试验方法等几个方面,阐述了如何精细设计弯折性能良好的FPCB。结合实际案例,深层次分析弯折失败的原因,对负面的影响因素进行了有效的回避和解决,涉及多个新的设计思路和拓展。
This paper systematically describes how to refine the design for flexible printed circuit board(FPCB)with excellent flexural endurance from several aspects,such as FPCB material,stack-up,outline design,circuit design,bending area,bending conditions and test method.Based on the practical cases and deep analyses of bending failure,new design ideas and directions are proposed to effectively avoid or solve the negative factors which impact the bending.
作者
张丽秋
桂海燕
于晓辉
ZHANG Liqiu;GUI Haiyan;YU Xiaohui(Mektec Manufacturing Corporation(Zhuhai),Ltd.,Zhuhai 519000,Guangdong,China)
出处
《印制电路信息》
2023年第11期37-42,共6页
Printed Circuit Information
