摘要
研究表明,影响信号系统信号完整性的因素,除设计、板材料、传输线、连接器、芯片封装外,导通孔也有较大影响。为避免没有起到任何连接或传输作用的通孔段造成高速传输信号反射、散射、延迟等,带来信号失真,通信板在印制电路板(PCB)加工过程中设置大量的背钻孔,将影响信号传输的孔壁铜通过钻咀切削钻除。背钻加工过程中铜丝韧性大,切削成丝状缠绕在钻咀排屑槽位置,导致背钻过程中残留物无法通过钻咀排屑槽正常排出。从减少背钻粉尘堵孔入手,就钻头结构、钻孔负压、分段钻孔方式、盖板材料4个方面进行分析和研究,探索有效改善和控制背钻堵孔的方法。
Research shows that in addition to the design,board material,transmission line,connector and chip package,the through hole has a great impact on the signal integrity of the signal system.In order to prevent the through hole segment that does not play any connection or transmission from resulting in signal distortion caused by high-seed signal transmission signal reflection,scattering and delay,a large number of back holes are set in the communication board during the processing of the printed circuit board.The hole wall copper that affects signal transmission is removed by cutting through the drill.In the process of back drilling,the copper wire has high toughness and is cut into filaments and wound around the chip removal slot in the drill.As a result,the residue cannot be discharged normally through the chip removal slot in the back drilling process.This paper analyzes and researches four aspects of drill structure,negative pressure of drilling,segmented drilling method and cover plate material,and explores effective ways to improve and control back drilling hole blocking.
作者
莫崇慧
MO Chonghui(Shenzhen Chongda Multilayer Circuit Board Co.,Ltd.,Shenzhen 518000,Guangdong,China)
出处
《印制电路信息》
2023年第10期15-20,共6页
Printed Circuit Information
关键词
背钻孔
钻头结构
钻孔负压
分段钻孔方式
盖板材料
back drilling hole
drill structure
negative pressure of drilling
segmented drilling method
cover plate material
