摘要
聚酰亚胺作为一种高性能的特种工程材料,因为其优秀的耐高温的性能,被广泛应用航空、航天、液晶、微电子等众多领域,并且随着光敏聚酰亚胺的出现,使得聚酰亚胺可以更好的结合3D打印技术,将聚酰亚胺制品的精度提高到了一个新的高度。综述了国内外光敏聚酰亚胺的研究进展,对光敏聚酰亚胺进行了系统的分类,并展望了光敏聚酰亚胺未来的发展方向。
As a kind of high performance special engineering material,polyimide is widely used in aviation,aerospace,liquid crystal,microelectronics and other fields because of its excellent high temperature resistance.With the emergence of photosensitive polyimide(PSPI),polyimide can be better combined with 3D printing technology,and the accuracy of polyimide products has been improved to a new height.The research progress of photosensitive polyimide at home and abroad was reviewed.The photosensitive polyimide was systematically classified,and the future development direction of photosensitive polyimide was prospected.
作者
刘森
孙初锋
Liu Sen;Sun Chufeng(School of Chemical Engineering,Key Laboratory of Environment-Friendly Composite Materials of the State Ethnic Affairs Commission,Northwest Minzu University,Lanzhou 730030,China)
出处
《山东化工》
CAS
2023年第12期63-65,共3页
Shandong Chemical Industry
基金
国家自然科学基金(52167003)
甘肃省重点研发计划项目(21YF5WA064)。
