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地面三维激光扫描仪在建(构)筑物测量分析中的应用综述 被引量:1

A review of application of terrestrial laser scanning in building seismic damage analysis
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摘要 地面三维激光扫描仪(Terrestrial Laser Scanning,TLS)作为新兴的一门技术,逐渐被应用到测量等各个领域,是获取地物目标LiDAR(Light Detection and Ranging)高精度数据的主要途径。TLS能够探测到建(构)筑物更多细节方面的信息,主要包括建筑物结构的变形和损伤(包括建筑物墙体的剪切开裂、墙面脱落及承重构件的损伤),同时可以获得诸如墙体倾斜、裂缝空间分布、体积和位置变化计算等更多的测量数据。TLS高精度数据的获取为提取变形较小、肉眼无法识别的破坏特征提供了技术帮助。本研究回顾总结了TLS在建筑物变形监测、三维建模、数据分析方法和建筑物震害损失分析方面的研究。在文献回顾和深入讨论后,提出了TLS在建筑物震害分析中未来的研究方向。 Terrestrial Laser Scanning(TLS),as an emerging technology,is gradually being applied to various fields such as surveying,and it is the main way to obtain LiDAR high-precision data for ground-based targets.TLS can detect more detailed information about the building,mainly including deformation and damage of the building structure(including shear cracking of the building walls,wall shedding and damage of load-bearing elements),and it can obtain more measurement data such as wall tilt,spatial distribution of cracks,volume and position change calculation,etc.The acquisition of TLS high-precision data provides technical assistance for extracting damage features that are less deformed and cannot be identified by the naked eye.This study reviews and summarizes the research of TLS in building deforma-tion monitoring,3D modeling,data analysis methods and building ballast loss analysis.After the literature review and in-depth discussion,future research directions of TLS in seismic analysis of buildings are proposed.
作者 杨凡 范志伟 温超 李晓丽 李志强 齐文华 Yang Fan;Fan Zhiwei;Wen Chao;Li Xiaoli;Li Zhiqiang;Qi Wenhua(Hebei Hongshan National Observatory on Thick Sediments and Seismic Hazards,Hebei Xingtai 055350,China;Hebei Earthquake Agency,Hebei Shijiazhuang 050021,China;Institute of Geology,China Earthquake Administration,Beijing 100029,China;China Earthquake Networks Center,Beijing 100045,China)
出处 《地震科学进展》 2023年第7期289-295,共7页 Progress in Earthquake Sciences
基金 河北省地震科技星火计划项目(DZ2021120300001) 国家自然科学基金(41907397)联合资助。
关键词 地面三维激光扫描仪 LIDAR 建筑物 地震震害 TLS LiDAR building seismic damage
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