摘要
卫星有效载荷系统逐渐开始采用相控阵天线作为收发装置,由于卫星的体积和重量受限,星载相控阵天线必须朝小型化、轻量化方向发展。传统砖块式架构的ka频段64元相控阵天线的剖面高度约60~80 mm,重量约2 kg。近年来,研究人员从设计、工艺和加工等不同方向探索和研究了瓦片式的相控阵天线,期望能从设计和加工方法上减小相控阵天线体积和重量,从设计方法入手,研究了一种基于系统集成封装技术的有源相控阵天线,该天线的辐射单元材料采用微带介质板,相较于其它形式的辐射单元具有更低的剖面高度,微波射频电路被封装到低温共烧陶瓷基板内部,射频走线与辐射单元平行布局,通过高集成化设计将微波电路和天线辐射单元进行一体化组装,与传统砖块式架构的相控阵天线相比,在具有相同辐射口径的前提下,设计的天线剖面高度缩减到30 mm,重量减小到1 kg,工作在Ka频段,波束扫描宽度达到±60°。满足了减小相控阵天线体积和重量的要求。
Satellite payload start to use phased-array antennas as transceiver devices.Due to the restricted size and weight of the satellite,the on-board phased-array antenna must develop in the direction of miniaturization and light weight.The profile height of Ka-band 64 element phased array antenna designed by traditional method is about 60~80 mm and weight is about 2 kg.In recent years,researchers have explored and studied tile type phased array antennas from different directions such as design,process and processing,expecting to reduce the size and weight of phased array antennas from design and processing methods.In this paper,an active phased array antenna based on system-integrated package(SIP)technology is studied.The antenna’s radiation cell material is made of microstrip dielectric plate,which has a lower profile height than other forms of radiation cells,and the microwave RF circuit is encapsulated inside a low temperature cofired ceramic(LTCC)substrate.The RF alignment is laid out in parallel with the radiation unit,and the microwave circuit and the antenna radiation unit are assembled in an integrated manner through a highly integrated design.Compared with the phased array antenna designed by traditional methods,the antenna profile height is reduced to 30 mm and the weight is reduced to 1 kg,Operating in the Ka-band,the beam sweep width up to±60°,which achieves the goal of reducing the size and weight of the phased array antenna with the same radiation aperture.
作者
薛江波
李岩
沈鑫
刘慧梁
XUE Jiangbo;LI Yan;SHEN Xin;LIU Huiliang(China Academy of Space Technology(Xi’an),Xi’an 710000,China;Innovation Center Satellite Communication System,China National Space Administration,Beijing 100094,China)
出处
《空间电子技术》
2023年第3期84-88,共5页
Space Electronic Technology
基金
民用航天技术预先研究项目(编号:D030103)。
关键词
系统集成封装
垂直互联
有源相控阵
system integrated package
vertical interconnect
active phased array
