摘要
随着航空电子技术朝着集成化、自动化、轻量化的方向发展,SOP、QFN等密脚元器件使用得越来越多,其管脚细小,间距较小,焊点承担的电、热、力的条件苛刻,使得焊点成为最为薄弱的连接环节。虚焊会造成电路板时好时坏,给电路板的调试、使用、维护带来重大隐患。本文介绍了虚焊的定义和检测方法,跟踪现场电路板虚焊的情况,分析主要原因,并探求解决措施,提升电路板焊接质量。
With the development of avionics technology in the direction of integration,automation and lightweight,more and more close-legged components such as SOP and QFN are used.Their pins are small,the spacing is small,and the electrical,thermal and mechanical conditions borne by the solder joint are harsh,which makes the solder joint the weakest link.The faulty soldering will cause the circuit board to change from good to bad,and bring major hidden dangers to the debugging,use and maintenance of the circuit board.This paper introduces the definition and detection method of faulty soldering,tracks the situation of faulty soldering of circuit board on site,analyzes the main reasons,and explores solutions to improve the quality of circuit board soldering.
作者
刘博
LIU Bo(Luoyang Electro-optical Equipment Research Institute of Aviation Industry Corporation,Luoyang Henan 471000)
出处
《中国科技纵横》
2023年第7期63-65,共3页
China Science & Technology Overview
关键词
虚焊
密脚元器件
焊点
faulty soldering
tight pin components
solder joint
