摘要
目的优化电镀3D打印工艺,提高单层电沉积厚度的均匀性。方法建立耦合电解液流动、物质传递、电极反应的多物理场模型,并数值求解,研究反应离子浓度和电解液电势的分布云图,以及沉积层截面形貌随时间的演化规律,分析影响沉积层厚度均匀性的直接因素。最后讨论抑制剂本体浓度CS、对流流速u0、电解液电导率κ及阴极电位φc等因素对沉积层厚度均匀性的影响规律。结果随着沉积时间的增长,沉积层的形貌越发不平整,反应离子浓度和电解液电势的分布云图随沉积层截面形貌的变化而变化。加入40μmol/L抑制剂后,沉积层表面的反应离子浓度和过电势的分布更加均匀。抑制剂本体浓度越高,沉积层截面形貌越平整,沉积层厚度均匀性越好,但存在一个饱和抑制剂浓度40μmol/L。沉积层厚度均匀性随对流流速或电解液电导率的增大先增后减,随阴极电位增大单调递增。结论阴极表面反应离子浓度和过电势的不均匀分布是导致沉积层厚度不均匀性的直接因素。添加抑制剂可有效改善沉积层厚度的均匀性,过大或过小的流速或电导率都会降低沉积层的厚度均匀性,适当提高阴极电位可提高沉积层厚度均匀性。
Electroplating 3D printing is one of the most important electrodeposition-based additive manufacturing technologies.Compared with traditional manufacturing technology,it has some distinct advantages such as high dimensional accuracy and great process repeatability.However,the thickness non-uniformity of the electrodeposited coatings is a bottleneck problem for the further development of the technology.This problem seriously affects the accuracy,availability,and mechanical properties of the printed parts.The work aims to optimize the electroplating 3D printing process and improve the thickness uniformity of single-layer electrodeposition.The multi-physical field theory model coupling electrolyte flow,mass transfer,and electrode reaction was established and numerically solved.The evolution law of the distribution cloud diagram of reactive ion concentration and electrolyte potential as well as deposited layer morphology with time was studied.Combined with electrode reaction kinetics,the direct factors affecting the thickness uniformity of the deposited layer were analyzed.Finally,the effect of main factors on the thickness uniformity of the deposited layer was discussed,such as inhibitor concentration in bulk solution CS,fluid velocity in bulk solution u0,conductivity of the electrolyteκ,and cathode potentialφc.The simulation results indicated that with the increase of deposition time,the morphology of the deposited layer became more and more uneven.The distribution cloud diagram of reactive ion concentration and electrolyte potential varied with the morphology of the deposited layer.The distribution uniformity of reactive ion concentration and overpotential on the surface of the deposited layer was improved after addition of 40μmol/L inhibitor.Generally,as the inhibitor concentration in bulk solution increased,the morphology of the deposited layer became smoother and the thickness uniformity of the deposited layer became better.However,there was a saturated concentration of 40μmol/L.When the saturation concentr
作者
汤家港
葛大丽
TANG Jia-gang;GE Da-li(Department of Modern Mechanics,University of Science and Technology of China,Hefei 230088,China;IAT-Chungu Joint Laboratory for Additive Manufacturing,University of Science and Technology of China,Hefei 230088,China;School of Architecture and Construction,Anhui Jianzhu University,Hefei 230601,China)
出处
《表面技术》
EI
CAS
CSCD
北大核心
2023年第3期318-326,共9页
Surface Technology
基金
安徽省重点研究与开发计划项目(1804a09020001)。
关键词
增材制造
电镀3D打印
厚度均匀性
电极反应动力学
物质传递
多物理场模型
additive manufacturing
electroplating 3D printing
thickness uniformity
kinetics of electrode reaction
material transfer
multi-physical field model
