摘要
在印制电路板(PCB)制造中,水平电镀线制作0.05mm的芯板铜厚均匀性较差,蚀刻不净不良率较高。通过测试对比不同厚度板的均匀性情况,分析芯板层铜厚均匀性差的原因;根据原因在水平电镀线第一个铜缸增加新阳极遮板降低芯板的飘动,在第二个铜缸阳极遮板的40~100mm区域增加塞子,屏蔽该区域的电流,以改善铜厚均匀性。结果表面:0.05mm的芯板电镀25μm铜,厚度极差由10.5μm下降至4.6μm;0.05mm的芯板均匀性可达到增层、外层板的均匀性水平。
In the manufacturing of printed boards,the copper thickness uniformity of the 0.05mm core made by the horizontal electroplating line is relatively poor,and the bad etching is relatively high.In this paper,the uniformity of different thicknesses of boards were compared to find out the reasons for the poor uniformity of the core layer.According to the reason,in the horizontal plating line,the first plating tank added a new foil guide to reduce the flutter of the core layer,and increased the plug in the 40~100mm area of the old foil guide of the second copper tank to improve the uniformity of copper thickness.The 0.05mm core layer was plated to 25μm,the copper thickness range decreased from 10.5μm to 4.6μm,and the improvement results showed that the uniformity of 0.05mm core plate could meet the uniformity level of the build layer and the outer layer.
作者
钱国祥
姚晓建
黄公松
张罗文
QIAN Guoxiang;YAO Xiaojian;HUANG Gongsong;ZHANG Luowen(Guangzhou Meiwei Electronics Co.,Ltd.,Guangzhou 510535,Guangdong,China)
出处
《印制电路信息》
2023年第5期41-46,共6页
Printed Circuit Information
关键词
印制板芯板
铜厚均匀性
新阳极遮板
printed circuit board core
copper thickness uniformity
new foil guide
