摘要
在生产挤塑聚苯乙烯板(XPS)的过程中会产生大量的颗粒废料,为避免产生环境问题,可将XPS颗粒废料用于制备轻骨料混凝土。采用外掺法研究聚苯颗粒掺量、XPS废料颗粒和可再分散性乳胶粉对轻骨料混凝土性能的影响。结果表明:聚苯颗粒体积掺量小于1200 mL时,与混凝土的抗压强度、抗折强度、密度呈线性关系,当聚苯颗粒体积掺量为1500 mL时在混凝土中趋向于饱和;可再分散性乳胶粉能改善聚苯颗粒与混凝土之间的界面问题,当质量掺量为6 g时,抗压强度提高了28%、抗折强度提高了48%。使用XPS颗粒等体积取代聚苯颗粒,XPS颗粒较大的空隙率导致导热系数升高;计算中去除颗粒之间空隙后,XPS颗粒等体积取代聚苯颗粒,当取代2/3的聚苯颗粒时导热系数降至0.0896 W/(m·K)。
A large amount of particle waste is produced during the production of extruded polystyrene board(XPS).In order to avoid environmental problems,XPS particle waste is used to prepare lightweight aggregate concrete.The influence of the content of polystyrene particles,XPS waste particles and redispersible latex powder on the performance of lightweight aggregate concrete was studied by the external mixing method.The results show that when the volume of polystyrene particles is less than 1200 mL,it has a linear relationship with the compressive strength,flexural strength and density of concrete.When the volume of polystyrene particles is 1500 mL,it tends to be saturated in concrete.Redispersible emulsion powder can improve the interface between polystyrene particles and concrete.When the content is 6 g,the compressive strength increases 28%and the flexural strength increases 48%.When XPS particles are used to replace polystyrene particles in equal volume,the larger porosity of XPS particles leads to the increase of thermal conductivity.After removing the gap between particles in the calculation,XPS particles replace polystyrene particles in equal volume,and the thermal conductivity decreases to 0.0896 W/(m·K)when replacing 2/3 of polystyrene particles.
作者
雷一鸣
李金凯
乔林
赵丕琪
刘宗明
LEI Yiming;LI Jinkai;QIAO Lin;ZHAO Piqi;LIU Zongming(College of Materials Science and Engineering,University of Jinan,Jinan 250022,China;Shandong Chuangwei External Wall Thermal Insulation Material Co.,Ltd.,Jinan 250013,China)
出处
《中国粉体技术》
CAS
CSCD
2023年第3期72-80,共9页
China Powder Science and Technology
基金
国家自然科学基金项目,编号:52172021。
关键词
轻骨料混凝土
挤塑板
聚苯颗粒
导热系数
light aggregate concrete
plastic extruded board
polystyrene particle
thermal conductivity
