摘要
为改善钎料在基板表面的润湿性能,采用激光加工技术在T2紫铜基板表面加工了两类不同阵列间距的直线型织构和网格型织构,探究表面织构对钎料润湿性能的影响。以BAg25CuZnSn焊条、BCu93P-A粉末为钎料,在T2紫铜表面进行润湿性试验,探讨表面织构类型及织构间距对钎料在T2紫铜基板上润湿性的影响。试验结果表明:对T2紫铜基板表面织构化,钎料铺展面积增大,钎料为BCu93P-A、网格型织构阵列间距为100μm时,铺展面积最大为322.4 mm^(2);随着织构阵列间距的减小,两种钎料的铺展面积均逐渐增大,且直线型织构化的基板润湿性能小于网格型织构化的基板。
To improve the wettability of solder on the substrate surface,T2 copper was selected as the substrate and two types of linear grooves and reticulated grooves with different array spacing were prepared on the surface of the copper using the HG100-20W laser marking machine.Wettability tests were carried out on the T2 copper surface using BAg25CuZnSn electrodes and BCu93P-A powder as the brazing material,and the effect of the surface fabric and the spacing of the fabric on the wettability of the brazing material on the T2 copper substrate was investigated.The experimental results show that the surface texture of the T2 copper substrate increases the spreading area of the solder.When the solder is BCu93P-A and the groove texture array spacing is 100μm,the maximum spreading area is 322.4 mm^(2).With the decrease of the texture array spacing,the spreading area of the two solders gradually increases,and the wettability of the linear textured substrate is smaller than that of the grid textured substrate.
作者
杨洋
周俞廷
赵亦嘉
YANG Yang;ZHOU Yuting;ZHAO Yijia(China Academy of Machinery Science and Technology Group,Beijing 100044,China;China Academy of Machinery Ningbo Academy of Intelligent Machine Tool Co.,Ltd.,Ningbo 315700,China)
出处
《电焊机》
2023年第4期120-125,共6页
Electric Welding Machine
基金
浙江省异质增材工程研究中心资助项目
浙江省“尖兵”“领雁”研发攻关计划(2022C01187)。
关键词
激光加工技术
表面织构
润湿性
铺展面积
laser processing technology
surface texture
wettability
spreading area
