摘要
铜及铜合金由于其优良的导电性,被广泛应用于电子、电气、工业制造等领域中,但是铜合金强度的提高往往伴随着电导率的下降。异质结构材料的强度通常大于利用混合规律计算出来的理论强度,通过调控这种额外的强化有望制备出具有优良强度和电导率的铜合金。以纯铜片和铜铬锆合金片为原料,通过扩散焊接、轧制和热处理制备了由铜铬锆层和粗晶铜层组成的层状异质结构材料,并且系统地研究了不同轧制量下CuCrZr/Cu层状异质结构材料的力学和导电性能。研究结果表明:CuCrZr/Cu层状异质结构材料的实际强度大于利用混合规律计算的强度,在轧制量为92%时抗拉强度为532 MPa、电导率为80%IACS、额外强化达到最大值45 MPa,额外强化随着轧制量的进一步增大反而减小。表明,通过调节界面影响区可以提高额外强化的大小,获得具有优良强度和电导率的铜合金。
Copper and copper alloys are widely used in electronics,electrical and industrial manufacturing due to their excellent electrical conductivity,but the increase in strength of copper alloys is often accompanied by a decrease in electrical conductivity.The strength of heterostructured materials is usually greater than the theoretical strength calculated using the rule of mixtures,and it is expected that copper alloys with excellent strength and conductivity can be prepared by modulating this extra strengthening.Heterogeneous laminated microstructure materials composed of Cu-Cr-Zr layers and copper coarse grain layers were prepared by diffusion bonding,rolling and heat treatment using pure copper sheets and Cu-Cr-Zr alloy sheets as raw materials.The mechanical properties and electrical conductivity of the heterogeneous laminated microstructure CuCrZr/Cu material with different rolling thickness reductions were systematically investigated.The results show that the real strength of heterogeneous laminated microstructure CuCrZr/Cu material is higher than that calculated using the rule of mixtures.An ultimate tensile strength of 532 MPa and an electrical conductivity of 80%IACS were achieved with the rolling thickness reduction of 92%.The extra strengthening reaches a maximum value of 45 MPa with the rolling thickness reduction of 92%,and the extra strengthening decreases with further increase in rolling thickness reduction.This indicates that the magnitude of extra strengthening can be increased by adjusting the interface-affected zone to obtain copper alloys with excellent strength and electrical conductivity.
作者
赖振民
彭康圳
揭晓华
麦永津
LAI Zhenmin;PENG Kangzhen;JIE Xiaohua;MAI Yongjin(School of Materials and Energy,Guangdong University of Technology,Guangzhou 510006,China;Advanced Metal Materials and Forming Engineering Technology Research Center of Guangdong Province,Guangzhou 510006,China)
出处
《材料研究与应用》
CAS
2023年第2期310-316,共7页
Materials Research and Application
基金
广州市科技计划项目(201904010406)。
关键词
层状异质结构
铜铬锆合金
扩散焊接
力学性能
电导率
heterogeneous laminated microstructure
Cu-Cr-Zr alloy
diffusion bonding
mechanical properties
electrical conductivity
