摘要
金丝键合[1]是利用热、压力、超声波能量使金丝与焊盘紧密结合,从而实现芯片与基板间的电气互联和芯片间的信息互通的一种技术。金丝键合是微组装的主流技术,也是一项关键技术。理想状态下,金丝和基板之间会发生原子间的相互扩散,从而使金与金之间实现原子量级上的键合。基板的金表层和金丝的可靠键合是非常关键的质量控制点。微波组件组装过程中,常常因为金丝键合出现缺陷而导致整个产品的失效。对软基板的金丝键合改进方案进行了研究,对比分析了改进前后的实验数据,得出了最优方案,优化了软基板金丝键合工艺的可靠性。试验结果表明,采取了有效的措施之后,消除了失效隐患,对提高软基板键合点的可靠性具有指导意义。
Gold wire bonding is a technology that uses heat, pressure and ultrasonic energy to closely combine the gold wire and welding pad, so as to realize the electrical interconnection between chips and substrate and the information exchange between chips. Wire bonding is the main technology of microassembly and a key technology. Ideally,interatomic diffusion occurs between the wires and the substrate, resulting in bonding on an atomic scale between gold and gold. The reliable bonding between the gold surface of the substrate and the gold wire is a very key quality control point. During the assembly of microwave components, the failure of the whole product is often caused by the defect of the wire bonding. The improvement scheme of the soft substrate gold wire bonding is studied, the experimental data before and after improvement are compared and analyzed, and the optimal scheme is obtained, and the reliability of the soft substrate gold wire bonding process is optimized. The experimental results show that after taking effective measures, the hidden trouble of failure is eliminated, which has guiding significance for improving the reliability of bonding point of soft substrate.
作者
杜雪靖
DU Xuejing(Nanjing Electronic Equipment Research Institute,Nanjing 211100,China)
出处
《电子质量》
2023年第1期68-72,共5页
Electronics Quality
关键词
金丝键合
软基板
等离子清洗
可靠性
gold wire bonding
soft substrate
plasma cleaning
reliability
