摘要
通过工艺实验与热切原理相结合得出影响热切质量的根本原因,提出了热切微观过程是决定热切质量的关键,通过改变热切方法能够更好地保证热切质量。并对全切工艺和半切工艺主体结构和基本原理进行了分析,指出了2种热切方法存在的精度问题和热切缺陷问题;提出了一种双面同步半切的新方法,并对该方法进行了分析,结果表明,双面同步半切能更好地解决热切质量问题。
The fundamental reasons that affecting thermal cutting quality are obtained by combination of thermal cutting process experiment and its principle in this paper. It is pointed out that thermal micro process is the key to determine thermal cutting quality,by changing thermal cutting method could assure thermal cutting quality well. The main structure and basic principle of full-cut process and half-cut process are analyzed,and the accuracy and defects of the two thermal cutting methods are described. The new method of double sided synchronous half-cut is proposed. Furthermore,by means of analyzing this new method,it is concluded that both sided synchronous half-cut method could solve the problem of thermal cutting quality well.
作者
闫文娥
高峰
YAN Wen'e;GAO Feng(The 2^(nd) Research Institute of CETC,Taiyuan 030024,China)
出处
《电子工业专用设备》
2022年第6期35-40,共6页
Equipment for Electronic Products Manufacturing
关键词
热切质量
热切微观过程
热切方法
热切缺陷
双面同步半切
Thermal cutting quality
Thermal cutting microscopic processes
Thermal cutting method
Defect of thermal cutting
Double sided synchronous half-cut
