摘要
利用差示扫描量热法(DSC)和红外光谱法(FT-IR)确定了三酚A型氰酸酯树脂的固化温度。同时,比较了聚三酚A型氰酸酯树脂与聚双酚A型氰酸酯的吸水性,耐热性能,动态力学性能和介电性能。动态力学热分析(DMA)结果表明三酚A型氰酸酯树脂的玻璃化转变温度为364℃,这比传统的双酚A型氰酸酯树脂高90℃以上。热重测试(TGA)结果表示,三酚A型氰酸酯树脂具有良好耐热性。介电性能测试结果显示三酚A型氰酸酯树脂具有较低的介电常数(小于3)和介质损耗角正切(小于0.009)。
The curing temperature of triphenol A cyanate ester resin is confirmed by FT-IR and DSC methods. The water absorption, heat resis-tance, dynamic mechanical and dielectric properties of the polytriphenol A cyanate ester resin and polybisphenol A cyanate ester resin are compared.Through the DMA analysis, it is confirmed that the glass transition temperature of triphenol A cyanate ester resin is 364 ℃ which is higher by 90℃ than that of bisphenol A cyanate ester resin. The TGA results show that the triphenol A cyanate ester resin has good heat resistance. Through the di-electric property test, it is found that the triphenol A cyanate ester resin has a low dielectric constant(less than 3) and dielectric loss tangent(less than 0.009).
作者
沙懿轩
吴健伟
付刚
匡弘
高星
SHA Yixuan;WU Jianwei;FU Gang;KUANG Hong;GAO Xing(Institute of Petrochemistry,Heilongjiang Academy of Sciences,Harbin 150040,China)
出处
《化学与粘合》
CAS
2023年第1期12-15,共4页
Chemistry and Adhesion
关键词
三酚A型氰酸酯树脂
固化温度
玻璃化转变温度
介电性能
triphenol A cyanate ester resin
curing temperature
glass transition temperature
dielectric property
