摘要
Characterizing immiscible metallic composites with electron microscopy and X-ray spectroscopy is the classic way of obtaining their structural and physical details.Nevertheless,such a combination lacks abil-ity to tell the interfacial interactions at grain boundaries.Here we demonstrate a novel strategy to un-cover the mystery of interfacial interactions in such systems by spectroscopic microscopy.The morpho-logical and spectral data of samples were simultaneously recorded and analyzed,which reveals critical information regarding interfacial electronic modes.Taking W-Cu as a model,we experimentally quanti-fied its connectivity and unambiguously identified conditional bonding between W and Cu.Further,we chemically reconstructed the specific W-Cu boundary that possessed the strongest interactions and inves-tigated its atomic structure.The mechanism of W-Cu bonding was proposed and verified by first-principle calculations.The above methodology holds great promise to serve as a universal approach in achieving in-depth understanding of immiscible composites.
基金
National Natural Science Foundation of China(No.52101032)to provide support for this work.F.T thanks the support from Beijing Natural Science Foun-dation(No.2214067).X.S.thanks the support from the National Natural Science Foundation of China(Nos.92163107,51621003).
