摘要
用有限元软件对纯铜进行大应变挤出切削(LSEM)仿真,通过改变切屑压缩比得到等效应变、等效应变率、温度分布的变化规律。进行LSEM试验,借助电子背散射衍射仪和维氏硬度计对比分析了不同切屑压缩比下纯铜切屑的显微组织和表面平均硬度。结果表明:切屑压缩比为1.5~2.5时,参考点沿给定轨迹线的等效应变随切屑压缩比增大而增大,而等效应变率的变化规律正好相反。同时,切屑压缩比越大,晶粒细化效果越好,拉长晶占比减小,出现等轴晶,且切屑表面平均硬度也越大。
Large strain extrusion machining(LSEM)simulation of copper using finite element analysis software,obtain effective strain distribution,effective strain rate distribution,and temperature distribution through the change of chip compression ratio.Proceeding LSEM experiment,contrastive analysis microstructure and average surface hardness of the copper chip under different chip compression ratios by means of electron back scattered diffraction and vickers hardness tester.The results show that when the chip compression ratio is between 1.5 and 2.5,the effective strain of the reference point along the given trajectory increases with the increase of the chip compression ratio.While the change law of the effective strain rate is just the opposite.At the same time,the greater the chip compression ratio,the better the grain refinement effect,the proportion of elongated crystals decreases,and equiaxed crystals appear,the chip surface average hardness also increases.
作者
高崇金
皮云云
王鸿博
GAO Chongjin;PI Yunyun;WANG Hongbo(Department of Intelligent Manufacturing,Shunde 528300,China;Department of Artificial Intelligence,Xi’an Jiaotong University,Xi'an 710048,China)
出处
《兵器材料科学与工程》
CAS
CSCD
北大核心
2022年第6期64-69,共6页
Ordnance Material Science and Engineering
基金
广东省重点领域研发计划(2019B010153003)。
