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熔渗法制备W/Y_(2)O_(3)-Cu复合材料的组织及性能 被引量:4

Microstructure and properties of W/Y_(2)O_(3)-Cu composites prepared by melt infiltration method
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摘要 以湿化学法制备的W-Y_(2)O_(3)复合粉末进行骨架烧结,随后在1150~1450℃范围内进行不同保温时间的熔渗15%(质量分数)Cu处理,探究不同熔渗工艺对W/Y_(2)O_(3)-Cu复合材料组织和性能的影响。结果表明,对于800 MPa压制压力的W-Y_(2)O_(3)生坯,在1550℃高温烧结下具有最佳骨架结构,并且在1250℃、3 h进行熔渗15%(质量分数)Cu后制备的W/Y_(2)O_(3)-Cu复合材料组织最为均匀,具有较高的热导率(185.4 W/m·K)、抗弯强度(1050.0 MPa)、气密性(5.3×10^(-11)Pa·m^(3)·S^(-1))和较低的热膨胀系数(6.7×10^(-6)/℃)。W/Y_(2)O_(3)-Cu复合材料的性能显著优于商业W-15%(质量分数)Cu复合材料,这主要归因于Y_(2)O_(3)掺杂对渗铜用W骨架组织和性能的改善。 W/Y_(2)O_(3)-Cu composite powder prepared by wet chemical method was skeleton sintered, followed by 15 wt%Cu treatment with different holding time in the range of 1 150-1 450 ℃, to explore the effect of different infiltration process on the microstructure and properties of W/Y_(2)O_(3)-Cu composite. The results show that, for the W/Y_(2)O_(3)-green billet with 800 MPa pressure, it has the best skeleton structure under high temperature sintering at 1 550 ℃, and the W/Y_(2)O_(3)-Cu composite prepared by melting 15 wt%Cu at 1 250 ℃ for 3 h has the most uniform structure. It has high thermal conductivity(185.4 W/m·K), bending strength(1 050.0 MPa), air tightness(5.3×10^(-11)Pa·m^(3)·s^(-1)) and low thermal expansion coefficient(6.7×10^(-6)/℃). The performance of W/Y_(2)O_(3)-Cu composites is significantly better than that of commercial W-15 wt%Cu composites, which is mainly attributed to the improvement of the microstructure and properties of W-skeleton used for copper infiltration by Y_(2)O_(3) doping.
作者 傅义毅 罗来马 吴玉程 FU Yiyi;LUO Laima;WU Chengyu(Industry and Equipment Technology,Hefei University of Technology,Hefei 230009,Anbui.China;School of Materials Science and Engineering,Hefei University of Technology,Hefei 230009,Anhui.China;Engineering Research Center of High Performance Copper Alloy Materials and Proessing.Ministry of Education,Hefei 230009,Anhui,China)
出处 《金属功能材料》 CAS 2022年第5期18-27,共10页 Metallic Functional Materials
基金 国家重点研发磁约束聚变能发展专项(2019YFE03120002)。
关键词 熔渗法 第二相强化 W/Y_(2)O_(3)-Cu复合材料 显微组织 性能 melting method second phase strengthening W/Y_(2)O_(3)-Cu composites microstructure performance
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