期刊文献+

斯特林制冷机热环境适应能力优化设计 被引量:3

Optimal design of thermal environment adaptability of Stirling cooler
原文传递
导出
摘要 针对长时间、自然对流散热条件下斯特林制冷机使用要求,基于Sage分析了室温腔温度对制冷机制冷性能影响,开展散热器结构优化。仿真优化了散热器翅片厚度、间距和翅高等参数,通过增加翅间距,减薄翅片,增长翅长等方式有效提高散热器散热能力,获得了最佳散热器结构。经对比试验得出:自然对流条件下,加装优化后的散热器,制冷机常温连续运行8小时,室温腔温度降低26.4℃,制冷量由0.29 W@65 K提升至0.72 W@65 K,有效提升了斯特林制冷机对特殊热工况的适用能力。 On demand of Stirling cooler operation under the condition of natural convection heat dissipation for long time,the influence of room temperature chamber temperature on the cooling performance of the cooler was analyzed based on Sage,and the radiator structure was optimized.The parameters of fin thickness,fin spacing and fin height of the radiator were simulated and optimized.By increasing fin spacing,thinning fins and increasing fin length,the heat dissipation capacity of the radiator is effectively improved,and the optimal structure of the radiator is obtained.The comparison test shows that under the natural convection condition,when the optimized radiator is installed,the cooler operates continuously at room temperature for 8 hours,the room temperature chamber temperature decreases by 26.4℃,and the cooling capacity increases from 0.29 W to 0.72 W at 65 K,which effectively improves the applicability of Stirling cooler.
作者 张文君 詹培 陶余钱 熊建华 Zhang Wenjun;Zhan Pei;Tao Yuqian;Xiong Jianhua(The 16th Research Institute of CETC,Hefei 230088,China;The Provincial Laboratory of Cryogenics and Refrigeration,Hefei 230088,China)
出处 《低温与超导》 CAS 北大核心 2022年第8期64-68,106,共6页 Cryogenics and Superconductivity
基金 中国电科技术创新基金(KJ1804006)资助。
关键词 斯特林制冷机 热环境 散热 优化 Stirling cooler Thermal environment Heat dissipation Optimization
  • 相关文献

参考文献5

二级参考文献65

  • 1刘兴明,韩琳,刘理天.室温红外探测器研究与进展[J].电子器件,2005,28(2):415-420. 被引量:3
  • 2温志伟,傅德平,顾国彪.浸润式混合强迫内冷的蒸发冷却汽轮发电机定子三维温度场的仿真分析[J].电工电能新技术,2006,25(3):13-17. 被引量:15
  • 3池田羲雄.实用热管技术[M].化学工业出版社,1998.10-13. 被引量:3
  • 4陶文铨.数值传热学[M].西安交通大学,2002.. 被引量:21
  • 5Jacobs H.R.,Hartnett J P.Thermal engineering:emerging technologies and critical phenomena[J].Workshop Report,NSF Grant No.CTS-91-04006.1991,139-176. 被引量:1
  • 6Hrishikesh panchawagh.Aplication of MEMS Technology for Cooling of Electronic Components[R].Report.18 April,2000. 被引量:1
  • 7Kishio Yokouchi et a1.Immersion Cooling for High-Density Packaging[J].IEEE Transaction on Components,Hybrids and Manufacturing Technology,Vol.CHMT-12,No.2,1987.6 被引量:1
  • 8Robert E.Simons.The Evolution of IBM High Performance Cooling Technology[J].IEEE PARTA,VOL.18,NO.4,DECEMBER 1995. 被引量:1
  • 9Richard D.Danielson etc.Cooling a Superfast Computer[J].Electronic Packaging& Production,July 1988,44-45. 被引量:1
  • 10Staio Y,Mochizuki M,goto K,Nauyen T etal.The application for personal computer using heat pipe technology[A].10th IHPC Preprints of Sessions e6 Stuttgart Sep.21~25,1997 被引量:1

共引文献87

同被引文献14

引证文献3

相关作者

内容加载中请稍等...

相关机构

内容加载中请稍等...

相关主题

内容加载中请稍等...

浏览历史

内容加载中请稍等...
;
使用帮助 返回顶部