摘要
楔形焊劈刀通常采用碳化钨、碳化钛、金属陶瓷等具备良好耐磨性的硬质材料,通过压力烧结的致密化技术制备,采用放电加工技术,使劈刀表面均匀且具备一定的粗糙度。劈刀表面的粗糙度主要影响键合时的高频摩擦过程,与引线键合结果具有较大的相关性。对键合过程机理进行了分析,并通过放电加工对劈刀的表面粗糙度进行改进,开展了不同表面粗糙度的劈刀键合试验,根据不同表面粗糙度劈刀键合结果的差异性,得出劈刀表面粗糙度对键合结果的影响规律,并据此给出楔形焊劈刀制备工艺的优化建议。
Bonding Wedges are usually made of hard materials with good wear resistance such as tungsten carbide,titanium carbide,cermet and other hard materials.The materials are prepared by pressure sintering densification technology and electrical discharge machining (EDM) technology to make the wedge surface uniform and have a certain roughness.The roughness of the wedge surface mainly affects the high-frequency friction process during bonding,which has a great correlation with the quality of wire bonding.The mechanism of heat ultrasonic bonding process is analyzed,and the wedge surface roughness is improved by EDM.The wedge bonding tests with different surface roughness are carried out.According to the differences of wedge bonding results with different surface roughness,the influence law of wedge surface roughness upon bonding results is obtained,and the optimization suggestions of wedge preparation process are given.
作者
贾斌
李文
李悦
李阳阳
谢兴铖
史植广
JIA Bin;LI Wen;LI Yue;LI Yangyang;XIE Xingcheng;SHI Zhiguang(The 29th Research Institute of CETC,Chengdu 610036,China;GRIMAT Engineering Institute Co.,Ltd.,Beijing 101407,China)
出处
《电子工艺技术》
2022年第5期278-281,共4页
Electronics Process Technology
