摘要
相控阵微系统的主要特征是电路与天线的高度融合集成,将三维微纳集成技术和微电子技术紧密地结合在一起,切合相控阵高频化、小型化和低成本的发展需求。本文设计了一款W波段的封装天线相控阵微系统,该相控阵采用硅基三维集成的方式将T/R多功能芯片、天线阵列集成在一个微系统模块中,并详细介绍了基于硅工艺的多功能收发芯片设计和相控阵封装天线设计。给出了相控阵微系统的测试结果。该微系统具有高集成度、高性能、低成本的特点,可以为高速无线通信、高精度探测和成像等应用提供一个较优的技术路径。
The main feature of the phased-array microsystem is the high integration of circuit and antenna, which closely combines the three-dimensional micro-nano integration and the microelectronics technology to meet the development needs of high frequency, miniaturization and low cost of the phased array. Phased-array micro-system with a packaged antenna operating in the W-band is designed and introduced in this article. The phased array integrates multi-functional chips and antenna together in a microsystem by means of silicon-based three-dimensional integration. The design of the multi-functional transceiver chip and the phased-array packaged-antenna are analyzed. The test results of the phased array microsystem are also provided. The microsystem exhibits the characteristics of high integration, high performance and low cost, paving a technically advantageous path for high data-rate wireless communication, high-precision detection, imaging and other applications.
作者
曹佳
李冠霖
陈鹏伟
刘劲松
李超
李君
CAO Jia;LI Guanlin;CHEN Pengwei;LIU Jinsong;LI Chao;LI Jun(Defense Technology Academy of China Aerospace Science and Industry Corporation,Beijing 100039,China;Beijing Institute of Radio Measurement,Beijing 100854,China;Institute of Microelectronics of the Chinese Academy of Sciences,Beijing 100029,China)
出处
《雷达科学与技术》
北大核心
2022年第4期378-384,共7页
Radar Science and Technology
关键词
相控阵微系统
多功能收发芯片
封装天线
W波段
phased-array microsystem
multi-functional transceiver chip
antenna-in-package
W band
