摘要
针对国产陶封FP结构器件再流焊接工艺助焊剂残留导致功能失效问题,进行原因分析、故障复现,确认了失效机理。根据失效机理提出了两种改进方案,进行了环境试验验证,试验结果证明方案有效,对于提高该类产品的可靠性具有一定的参考价值。
Aiming at the functi on failure caused by the residual flux in the reflow soldering process of domestic ceramic sealed FP structural devices,the cause analysis and fault recurrence are carried out,and the failure mechanism is confirmed.On the base of the failure mechanism,two process schemes are proposed,and the environment test verification is carried out.The test results show that the schemes are effective,which has certain reference significance to improve the reliability of this kind of products.
作者
黄益军
席赟杰
HUANG Yijun;XI Yunjie(The 58th Research Institute of CETC,Wuxi 214072,China)
出处
《电子产品可靠性与环境试验》
2022年第4期41-46,共6页
Electronic Product Reliability and Environmental Testing
