摘要
近年来,双密度四通道小型可插拔封装(QSFP-DD)形式的200/400 Gbit/s光模块,以其相对低功耗和体积小便于高密度部署的优势得到电信市场和数据中心市场的青睐,但高速率和小体积带来的散热条件恶化问题限制了QSFP-DD光模块的使用环境。文章采用有限元方法对QSFP-DD模块进行热学建模仿真,研究了200 Gbit/s QSFP-DD 4通道长距离(LR4)光模块在高温环境下的内部温度场,验证了导热垫对改善模块内部散热条件的效果,并实测了模块在高温环境下的性能,为QSFP-DD光模块的设计和应用提供了参考。
In recent years,200/400 Gbit/s transceiver in the form of Quad Small Form Factor Pluggable-Double Density(QSFP-DD)is favored by the market due to their relatively low power consumption and small size for high-density deployment.However,the deterioration of heat dissipation caused by high speed and small size limits the application of QSFP-DD optical modules.In this paper,the finite element method is used to conduct thermal modeling and simulation of QSFP-DD module,and the internal temperature field of 200 Gbit/s QSFP-DD Long Range 4(LR4)optical module in high temperature environment is studied.The effect of thermal pad on improving the internal heat dissipation of the module is verified.The performance of the module in high temperature environment is measured.It provides a reference for the design and application of QSFP-DD transceiver module.
作者
叶宇
马雁潮
YE Yu;MA Yan-chao(Shenzhen Hi-Optel Technology Co.,Ltd.,Shenzhen 518000,China;Shenzhen Hengpu Technology Co.,Ltd.,Shenzhen 518000,China)
出处
《光通信研究》
2022年第4期47-51,共5页
Study on Optical Communications
基金
国家自然科学基金资助项目(61771024,61627814,61505002,61690194,61605004)
教育部新世纪优秀人才支持计划资助项目
浙江大学引进人才科研启动基金资助项目。
