摘要
印制电路板(PCB)采用埋铜块(Coin)设计后,埋入的铜块其表面在SMT加工后容易与树脂剥离或分层,导致严重的品质损失。本文通过DOE详尽地分析了多维度的相关因素,验证了不同参变量对其产生的影响,从而摸索出可靠、适用的工艺参数,显著提升了成品良率。
Because of the poor bonding between the copper coin and resin in embedded copper coin PCB,the delamination was partly happened in the mass production in the soldering process,so we need to analysis the principle of all the related factors and confirm the key factors via DOE to promote the heat-resisting reliability.
出处
《印制电路信息》
2022年第4期30-37,共8页
Printed Circuit Information
关键词
铜块
分层
裂纹
黑化
棕化
Copper Coin
Delamination
Crack
Black Oxide
Brown Oxide
