摘要
100G SR4光模块具有传输速率高、技术成熟和成本低等优势,已广泛应用于数据中心和数据通信接入网等领域。文中采用板上芯片封装(chip on board,COB)封装技术对100G SR4光模块电路、光路部分进行了开发设计,并采用自制测试系统对模块的发射接收性能进行了测试。测试结果表明,该模块完全符合协议的各项指标,可满足100 m短距离高速数据通信系统的要求。
100 G SR4 optical module with the advantages of high transmission rate, mature technology and low cost has been widely used in data centers and data communication access networks. The circuit and optical path of 100 G SR4 optical module has been designed with the method of chip on board(COB)packaging technology, and the transmitting and receiving performances of the module is tested by the self-made testing system. Testing results show that the module accords with the characteristics of the agreement and can meet the requirements of 100 m short distance high-speed data communication system.
作者
于佩
王波
秦彬
YU Pei;WANG Bo;QIN Bin(Allray Inc,Zhenjiang,China)
出处
《光电技术应用》
2022年第1期44-47,共4页
Electro-Optic Technology Application
关键词
100G
SR4
COB封装技术
光弯折
有源耦合
100 G SR4
chip on board(COB)packaging technology
bending of light
active coupling
